The invention relates to a method for the production of a self-supporting copper foil, which, due to its structure, presents low shear resistance, and can be embossed to have sharp edges. The copper foil is electrodeposited onto a cathode cylinder immersed in an electrolytic copper bath and surrounded by a rotating anode coil. Said copper foil is then detached from the cathode cylinder. A standard electrolytic copper bath is used with such additives as to give the copper foil a laminar-structured dentritic hardness. The laminar extruded structure provides the copper foil thus produced with a reinforced hardness, thus increasing its brittleness. This provides the copper with substantially enhanced contour acuity when embossing is carried out.