Invention Application
- Patent Title: A SILICA AND A SILICA-BASED SLURRY
- Patent Title (中): 二氧化硅和二氧化硅基浆
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Application No.: PCT/US2002/018575Application Date: 2002-06-13
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Publication No.: WO2002102920A1Publication Date: 2002-12-27
- Inventor: HELLRING, Stuart, D. , MC CANN, Colin, P. , BABU, Suryadevara, V. , LI, Yuzhuo , SATISH, Narayanan
- Applicant: PPG INDUSTRIES OHIO, INC.
- Applicant Address: 3800 West 143rd Street, Cleveland, OH 44111 US
- Assignee: PPG INDUSTRIES OHIO, INC.
- Current Assignee: PPG INDUSTRIES OHIO, INC.
- Current Assignee Address: 3800 West 143rd Street, Cleveland, OH 44111 US
- Agency: MARMO, Carol, A.
- Priority: US09/882,549 20010614
- Main IPC: C09K3/14
- IPC: C09K3/14
Abstract:
This invention relates to a silica, a slurry composition, and a method of their preparation. In particular, the silica of the present invention includes aggregated primary particles. The slurry composition which incorporates the silica, is suitable for polishing articles and especially useful for chemical-mechanical planarization of semiconductor substrates and other microelectronic substrates.
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