Abstract:
Methods are disclosed in which an electrically conductive substrate is immersed into an electrodepositable composition, the substrate serving as an electrode in an electrical circuit comprising the electrode and a counter-electrode immersed in the composition, a coating being applied onto or over at least a portion of the substrate as electric current is passed between the electrodes. The electrodepositable composition comprises: (a) an aqueous medium; (b) an ionic resin; and (c) solid particles.
Abstract:
A method for producing ultrafine metal carbide particles and hydrogen is disclosed. The method includes introducing a metal-containing precursor and a carbon-containing precursor into a thermal reaction chamber, heating the precursors in the thermal reaction chamber to form the ultrafine metal carbide particles from the precursors and to form carbon monoxide and hydrogen, collecting the ultrafine doped metal carbide particles, converting at least a portion of the carbon monoxide to carbon dioxide and generating additional hydrogen, and recovering at least a portion of the hydrogen.
Abstract:
This invention relates to a silica, a slurry composition, and a method of their preparation. In particular, the silica of the present invention includes aggregated primary particles. The slurry composition which incorporates the silica, is suitable for polishing articles and especially useful for chemical-mechanical planarization of semiconductor substrates and other microelectronic substrates.
Abstract:
A coating composition includes a polymer prepared from a mixture of reactants including (a) a fluorinated polysiloxane and (b) an alkoxy silane functional resin. The alkoxy silane functional resin includes a polyurethane resin or an acrylic resin. A substrate at least partially coated with the coating composition is also disclosed. A method of condensing a polar fluid by contacting a substrate at least partially coated with the coating composition with a polar fluid, such that the polar fluid condenses on at least a portion of the coated substrate is also disclosed.
Abstract:
This invention relates to a slurry composition and a method of its preparation. In particular, the slurry composition of the present invention includes a silica wherein the silica comprises a surface modification. The silica-based slurry of the present invention is suitable for polishing articles and especially useful for chemical-mechanical planarization ("CMP") of semiconductor and other microelectronic substrates.