Invention Application
WO03008940A9 CONFOCAL 3D INSPECTION SYSTEM AND PROCESS 审中-公开
CONFOCAL 3D检查系统和过程

CONFOCAL 3D INSPECTION SYSTEM AND PROCESS
Abstract:
A confocal three dimensional inspection system (120), and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers (S), other semiconductor substrates (S) and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.
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