Invention Application
- Patent Title: METHOD FOR MAKING ELECTRONIC DEVICES
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Application No.: PCT/US2006/020445Application Date: 2006-05-25
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Publication No.: WO2006132822A3Publication Date: 2006-12-14
- Inventor: GOWDA, Arun, Virupaksha , TONAPI, Sandeep, Shrikant , MILLS, Ryan, Christopher , ESLER, David, Richard , LATHAM, Stephen, Andrew , CAMPBELL, John, Robert
- Applicant: GENERAL ELECTRIC COMPANY( A NEW YORK CORPORATION) , GOWDA, Arun, Virupaksha , TONAPI, Sandeep, Shrikant , MILLS, Ryan, Christopher , ESLER, David, Richard , LATHAM, Stephen, Andrew , CAMPBELL, John, Robert
- Applicant Address: 1 River Road Schenectady, NY 12345 US
- Assignee: GENERAL ELECTRIC COMPANY( A NEW YORK CORPORATION),GOWDA, Arun, Virupaksha,TONAPI, Sandeep, Shrikant,MILLS, Ryan, Christopher,ESLER, David, Richard,LATHAM, Stephen, Andrew,CAMPBELL, John, Robert
- Current Assignee: GENERAL ELECTRIC COMPANY( A NEW YORK CORPORATION),GOWDA, Arun, Virupaksha,TONAPI, Sandeep, Shrikant,MILLS, Ryan, Christopher,ESLER, David, Richard,LATHAM, Stephen, Andrew,CAMPBELL, John, Robert
- Current Assignee Address: 1 River Road Schenectady, NY 12345 US
- Agency: TOOP, Barbara, A. et al.
- Priority: US11/146,838 20050607
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L21/56 ; H01L23/373 ; H01L21/48
Abstract:
Disclosed are methods for forming an electronic device that comprises a material that functions as an underfill material as well as a thermal interface material simultaneously. The electronic assembly comprising a heat dissipating element, a semiconductor chip, a substrate and a thermally conductive material is also given here, wherein the thermally conductive material serves as an underfill material as well as a thermal interface material simultaneously.
Information query
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