公开(公告)号：WO2007001803A2

公开(公告)日：2007-01-04

申请号：PCT/US2006022587

申请日：2006-06-09

Applicant: GEN ELECTRIC ,  RUBINSZTAJN SLAWOMIR ,  CAMPBELL JOHN ROBERT ,  MILLS RYAN CHRISTOPHER ,  TONAPI SANDEEP SHRIKANT ,  PRABHAKUMAR ANANTH

Inventor： RUBINSZTAJN SLAWOMIR ,  CAMPBELL JOHN ROBERT ,  MILLS RYAN CHRISTOPHER ,  TONAPI SANDEEP SHRIKANT ,  PRABHAKUMAR ANANTH

IPC: B01J31/00 ,  C08G59/68 ,  C08G59/70 ,  H01L23/29

CPC classification number: H01L23/293 ,  B01J31/0237 ,  B01J31/0244 ,  B01J31/146 ,  C08G59/68 ,  C08G59/70 ,  H01L21/563 ,  H01L24/81 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen- containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.

Abstract translation: 提供固化催化剂。 固化催化剂可以包括路易斯酸和含氮分子或非叔膦中的一种或两种。 含氮分子可以包括单胺或杂环芳族有机化合物。 可固化组合物可以包含固化催化剂。 电子器件可以包括可固化组合物。 还提供了与前述相关的方法。

公开(公告)号：WO2004094359A1

公开(公告)日：2004-11-04

申请号：PCT/US2004/008721

申请日：2004-03-22

Applicant: GENERAL ELECTRIC COMPANY ,  MILLS, Ryan, Christopher ,  PRESSMAN, Eric, James ,  CHUCK, Timothy, Leigh ,  OFORI, John, Yaw

Inventor： MILLS, Ryan, Christopher ,  PRESSMAN, Eric, James ,  CHUCK, Timothy, Leigh ,  OFORI, John, Yaw

IPC: C07C46/08

CPC classification number: C07C46/08 ,  C07C37/07 ,  C07C37/62 ,  C07C50/02 ,  C07C50/04 ,  C07C39/27 ,  C07C39/08

Abstract: A method is described for the simultaneous preparation of p-bromophenols and p-benzoquinones, intermediates useful in the preparation of hydroquinones and 4,4’-dihydroxybiphenyls, respectively. Hydroquinones and 4,4’-dihydroxybiphenyls are useful monomers for the preparation of a variety of polymers. The method also comprises reducing the p-benzoquinone to its corresponding hydroquinone in the presence of the p-bromophenol. Limiting the amount of HBr present in the reaction mixture was shown to control the amount of benzoquinone produced. The method also allows for the recycling of many of the reagents used, thereby reducing the cost of producing each monomer.

Abstract translation: 描述了同时制备对溴苯酚和对苯醌的方法，分别用于制备氢醌和4,4'-二羟基联苯的中间体。 氢醌和4,4'-二羟基联苯是用于制备各种聚合物的有用单体。 该方法还包括在对溴苯酚的存在下将对苯醌还原成其对应的氢醌。 显示出限制反应混合物中存在的HBr的量来控制所产生的苯醌的量。 该方法还允许循环使用许多试剂，从而降低生产每种单体的成本。

公开(公告)号：WO2004064695A1

公开(公告)日：2004-08-05

申请号：PCT/US2003/041825

申请日：2003-12-18

Applicant: GENERAL ELECTRIC COMPANY ,  PRESSMAN, Eric, James ,  OFORI, John, Yaw ,  SOLOVEICHIK, Grigorii, Lev ,  MILLS, Ryan, Christopher ,  MALE, Jonathan, Lloyd

Inventor： PRESSMAN, Eric, James ,  OFORI, John, Yaw ,  SOLOVEICHIK, Grigorii, Lev ,  MILLS, Ryan, Christopher ,  MALE, Jonathan, Lloyd

IPC: C07C37/62

CPC classification number: C07C37/18 ,  C07C37/02 ,  C07C37/62 ,  C07C39/27 ,  C07C39/08 ,  C07C39/15

Abstract: Brominated hydroxyaromatic compounds such as p-bromophenol are prepared by contacting a hydroxyaromatic compound with oxygen and a bromine source such as hydrogen bromide or an alkali metal or alkaline earth metal bromide in an acidic medium, in the presence of elemental copper or a copper compound as catalyst. The brominated product of this reaction may be converted alternately to a dihydroxyaromatic compound such as hydroquinone by hydrolyses, or a dihydroxybiphenyl compound such as 4,4’-dihydroxybiphenyl by reductive coupling.

Abstract translation: 通过在酸性介质中，在元素铜或铜化合物存在下使羟基芳族化合物与氧和溴源如溴化氢或碱金属或碱土金属溴化物在酸性介质中接触来制备溴对羟基芳族化合物，如 催化剂。 该反应的溴化物可以通过还原偶联来交替地转化成二羟基芳族化合物如氢醌，或二羟基联苯化合物如4,4'-二羟基联苯。

公开(公告)号：WO2008021135A8

公开(公告)日：2008-04-03

申请号：PCT/US2007017636

申请日：2007-08-08

Applicant: MOMENTIVE PERFORMANCE MAT INC ,  MILLS RYAN CHRISTOPHER ,  RUBINSZTAJN SLAWOMIR ,  ESLER DAVID RICHARD ,  SIMON DAVID ANDREW ,  WHEELOCK KENNETH STEVEN

Inventor： MILLS RYAN CHRISTOPHER ,  RUBINSZTAJN SLAWOMIR ,  ESLER DAVID RICHARD ,  SIMON DAVID ANDREW ,  WHEELOCK KENNETH STEVEN

IPC: C08J3/00 ,  C08L101/00

CPC classification number: C08J3/005 ,  C08L83/10 ,  C08L83/00

公开(公告)号：WO2008021139A1

公开(公告)日：2008-02-21

申请号：PCT/US2007/017643

申请日：2007-08-08

Applicant: MOMENTIVE PERFORMANCE MATERIALS INC. ,  MILLS, Ryan, Christopher ,  RUBINSZTAJN, Slawomir ,  CAMPBELL, John, Robert

Inventor： MILLS, Ryan, Christopher ,  RUBINSZTAJN, Slawomir ,  CAMPBELL, John, Robert

IPC: C08G65/18

CPC classification number: C08G65/18

Abstract: An underfill composition including a polymer precursor is provided. The polymer precursor includes (4) or more pendant oxetane functional groups. The underfill composition includes greater than about (20) weight percent of the polymeric precursor. Associated article and method are also provided.

Abstract translation: 提供了包含聚合物前体的底部填充组合物。 聚合物前体包括（4）或更多个氧杂环丁烷官能团。 底部填充组合物包括大于约（20）重量百分比的聚合物前体。 还提供了相关的文章和方法。

公开(公告)号：WO2008021135A2

公开(公告)日：2008-02-21

申请号：PCT/US2007/017636

申请日：2007-08-08

Applicant: MOMENTIVE PERFORMANCE MATERIALS INC. ,  MILLS, Ryan, Christopher ,  RUBINSZTAJN, Slawomir ,  ESLER, David, Richard ,  SIMON, David, Andrew ,  WHEELOCK, Kenneth, Steven

Inventor： MILLS, Ryan, Christopher ,  RUBINSZTAJN, Slawomir ,  ESLER, David, Richard ,  SIMON, David, Andrew ,  WHEELOCK, Kenneth, Steven

IPC: C08J3/00 ,  C08L101/00

CPC classification number: C08J3/005 ,  C08L83/10 ,  C08L83/00

Abstract: A syneretic composition is provided. The syneretic composition includes a first curable material comprising an alcohol and an anhydride, and a second curable material. At a first temperature (T 1 ) the first curable material cures to form a polymeric matrix, and the second curable material has a degree of conversion that is less than 50 percent. The second curable material is liquid and capable of exuding from the polymeric matrix at a syneresis temperature (T syn ). A method and an article are provided also.

Abstract translation: 提供了一种综合组合物。 该共同组合物包括包含醇和酸酐的第一可固化材料和第二可固化材料。 在第一温度（T 1→1）下，第一可固化材料固化形成聚合物基质，第二可固化材料的转化度小于50％。 第二可固化材料是液体的并且能够以脱水收缩温度（T> syn syn）从聚合物基质中渗出。 还提供了一种方法和物品。

公开(公告)号：WO2008019151A1

公开(公告)日：2008-02-14

申请号：PCT/US2007/017642

申请日：2007-08-08

Applicant: MOMENTIVE PERFORMANCE MATERIALS INC. ,  MILLS, Ryan, Christopher ,  CAMPBELL, John, Robert ,  RUBINSZTAJN, Slawomir

Inventor： MILLS, Ryan, Christopher ,  CAMPBELL, John, Robert ,  RUBINSZTAJN, Slawomir

IPC: C08L83/06 ,  C07D305/04 ,  C08G65/18

CPC classification number: C08L83/06 ,  C07D407/14 ,  C08G65/18

Abstract: An underfill composition including a polymer precursor is provided. The polymer precursor includes an inorganic backbone and one or more pendant oxetane functional groups. Associated article and method are also provided.

Abstract translation: 提供了包含聚合物前体的底部填充组合物。 聚合物前体包括无机主链和一个或多个侧链氧杂环丁烷官能团。 还提供了相关的文章和方法。

公开(公告)号：WO2006135556A3

公开(公告)日：2007-04-19

申请号：PCT/US2006020685

申请日：2006-05-30

Applicant: GEN ELECTRIC ,  TONAPI SANDEEP SHRIKANT ,  CAMPBELL JOHN ROBERT ,  MILLS RYAN CHRISTOPHER ,  ZHANG JIAN ,  LATHAM STEPHEN ANDREW

Inventor： TONAPI SANDEEP SHRIKANT ,  CAMPBELL JOHN ROBERT ,  MILLS RYAN CHRISTOPHER ,  ZHANG JIAN ,  LATHAM STEPHEN ANDREW

IPC: H01L23/373 ,  C09J7/00 ,  C09K5/00

CPC classification number: H01L23/3737 ,  C09J7/10 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T428/31511 ,  H01L2924/00

Abstract: A B-stageable film that includes a thermal interface material is provided. The film may secure a heat-generating device to a heat-dissipating component, may further cross-link, and may conduct thermal energy from the heat-generating device to the heat-dissipating component. A method of making and using the film is provided, as well as a device that incorporates the film.

Abstract translation: 提供了包括热界面材料的可B阶段的膜。 该膜可以将发热装置固定到散热部件，可以进一步交联，并且可以将热能从发热装置传导到散热部件。 提供了制造和使用该膜的方法，以及包含该膜的装置。

公开(公告)号：WO2006132822A3

公开(公告)日：2006-12-14

申请号：PCT/US2006/020445

申请日：2006-05-25

Applicant: GENERAL ELECTRIC COMPANY( A NEW YORK CORPORATION) ,  GOWDA, Arun, Virupaksha ,  TONAPI, Sandeep, Shrikant ,  MILLS, Ryan, Christopher ,  ESLER, David, Richard ,  LATHAM, Stephen, Andrew ,  CAMPBELL, John, Robert

Inventor： GOWDA, Arun, Virupaksha ,  TONAPI, Sandeep, Shrikant ,  MILLS, Ryan, Christopher ,  ESLER, David, Richard ,  LATHAM, Stephen, Andrew ,  CAMPBELL, John, Robert

IPC: H01L21/60 ,  H01L21/56 ,  H01L23/373 ,  H01L21/48

Abstract: Disclosed are methods for forming an electronic device that comprises a material that functions as an underfill material as well as a thermal interface material simultaneously. The electronic assembly comprising a heat dissipating element, a semiconductor chip, a substrate and a thermally conductive material is also given here, wherein the thermally conductive material serves as an underfill material as well as a thermal interface material simultaneously.

公开(公告)号：WO2006107659A1

公开(公告)日：2006-10-12

申请号：PCT/US2006/011313

申请日：2006-03-28

Applicant: GENERAL ELECTRIC COMPANY ,  CAMPBELL, John, Robert ,  RUBINSZTAJN, Siawomir ,  GIBSON, David, Alexander, III ,  TONAPI, Sandeep, Shrikant ,  MILLS, Ryan, Christopher ,  PRABHAKUMAR, Ananth

Inventor： CAMPBELL, John, Robert ,  RUBINSZTAJN, Siawomir ,  GIBSON, David, Alexander, III ,  TONAPI, Sandeep, Shrikant ,  MILLS, Ryan, Christopher ,  PRABHAKUMAR, Ananth

IPC: C08L63/00 ,  C08K9/06 ,  H01L23/29 ,  H01L21/56

CPC classification number: C08G59/3218 ,  C08G59/24 ,  C08G59/4215 ,  C08G59/68 ,  C08K3/36 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  Y10T428/31511 ,  C08L63/00 ,  H01L2924/00

Abstract: A composition comprises a first curable resin composition that includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds, combinations thereof, and mixtures thereof. The composition can include a separate second curable fluxing composition that comprises at least one epoxy resin. The first curable resin or the combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.

Abstract translation: 组合物包含第一可固化树脂组合物，其包含至少一种与溶剂组合的芳族环氧树脂，官能化胶态二氧化硅分散体和至少一种选自脂环族单体，脂族环氧单体，羟基芳族化合物 化合物，其组合，及其混合物。 组合物可以包括单独的第二可固化助熔组合物，其包含至少一种环氧树脂。 第一可固化树脂或两种树脂组合物的组合可用于生产底部填充材料，并且适合用作电子芯片的密封剂。