Invention Application
- Patent Title: 用于抛光低介电材料的抛光液
- Patent Title (English): Polishing slurry for low dielectric material
-
Application No.: PCT/CN2007/002102Application Date: 2007-07-09
-
Publication No.: WO2008025209A1Publication Date: 2008-03-06
- Inventor: 宋伟红 , 陈国栋 , 荆建芬 , 姚颖 , 宋成兵
- Applicant: 安集微电子(上海)有限公司 , 宋伟红 , 陈国栋 , 荆建芬 , 姚颖 , 宋成兵
- Applicant Address: 中国上海市浦东新区张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 201203 CN
- Assignee: 安集微电子(上海)有限公司,宋伟红,陈国栋,荆建芬,姚颖,宋成兵
- Current Assignee: 安集微电子（上海）有限公司,宋伟红,陈国栋,荆建芬,姚颖,宋成兵
- Current Assignee Address: 中国上海市浦东新区张江高科技园区龙东大道3000号5号楼613-618室, Shanghai 201203 CN
- Agency: 上海虹桥正瀚律师事务所
- Priority: CN200610030457.2 20060825
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/304 ; C09K3/14
Abstract:
A polishing slurry for low dielectric material is disclosed. It includes abrasive and water, and is characterized in that, it further contains one or more kinds of metal chelating agents, azole-species as film-forming agent and oxidizing agent. Under lower pressure, the present polishing slurry has higher polishing speed on low dielectric material, suitable polishing selectivity for other materials, and better surface finish after polishing.
Information query
