Invention Application
WO2008038863A1 NOVEL ORGANOSILANE POLYMER, HARDMASK COMPOSITION FOR RESIST UNDERLAYER FILM COMPRISING THE ORGANOSILANE POLYMER, AND PROCESS OF PRODUCING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION 审中-公开
新型有机硅聚合物,用于包含有机硅聚合物的耐下胶膜的HARDMASK组合物,以及使用HARDMASK组合物生产半导​​体集成电路装置的方法

NOVEL ORGANOSILANE POLYMER, HARDMASK COMPOSITION FOR RESIST UNDERLAYER FILM COMPRISING THE ORGANOSILANE POLYMER, AND PROCESS OF PRODUCING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION
Abstract:
A hardmask composition for processing a resist underlayer film is provided. The hardmask composition comprises: (a) an organosilane polymer prepared by reacting polycondensation products of hydrolysates of compounds represented by Formulae 1, 2 and 3: [RO] 3 Si-Ar (1) (wherein R is methyl or ethyl and Ar is an aromatic ring-containing functional group), [RO] 3 Si-H (2) (wherein R is methyl or ethyl), and [RO] 3 Si-R' (3) (wherein R is methyl or ethyl and R'is substituted or unsubstituted cyclic or acyclic alkyl) with ethyl vinyl ether of Formula 4: CH 2 CHOCH 2 CH 3 (4) in the presence of an acid catalyst; (b) a solvent; and (c) a crosslinking catalyst.
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