Invention Application
WO2014110039A3 REMOVAL OF SELECTED PORTIONS OF PROTECTIVE COATINGS FROM SUBSTRATES
审中-公开
从基材上去除选定的保护涂层部分
- Patent Title: REMOVAL OF SELECTED PORTIONS OF PROTECTIVE COATINGS FROM SUBSTRATES
- Patent Title (中): 从基材上去除选定的保护涂层部分
-
Application No.: PCT/US2014010510Application Date: 2014-01-07
-
Publication No.: WO2014110039A3Publication Date: 2014-10-23
- Inventor: ASTLE DAVID JAMES , CHILD TYLER CHRISTENSEN , KASAGANI VIMAL KUMAR , LOOSE CAMERON LAMAR , STEVENS BLAKE LEROY , SORENSON MAX ERNEST
- Applicant: HZO INC
- Assignee: HZO INC
- Current Assignee: HZO INC
- Priority: US201361750254 2013-01-08; US201361750257 2013-01-08
- Main IPC: B05D5/12
- IPC: B05D5/12
Abstract:
A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.
Public/Granted literature
- WO2014110039A8 REMOVAL OF SELECTED PORTIONS OF PROTECTIVE COATINGS FROM SUBSTRATES Public/Granted day:2014-09-04
Information query
