MASKING SUBSTRATES FOR APPLICATION OF PROTECTIVE COATINGS
    2.
    发明申请
    MASKING SUBSTRATES FOR APPLICATION OF PROTECTIVE COATINGS 审中-公开
    掩蔽基底以涂覆保护涂层

    公开(公告)号:WO2014110046A8

    公开(公告)日:2014-09-04

    申请号:PCT/US2014010526

    申请日:2014-01-07

    Applicant: HZO INC

    Abstract: A method for applying a protective coating to selected portions of a substrate is disclosed. The method includes applying a mask to or forming a mask on at least one portion of the substrate that is not to be covered with the protective coating. The mask may be selectively formed by applying a flowable material to the substrate. Alternatively, the mask may be formed from a preformed film. With the mask in place, the protective coating may be applied to the substrate and the mask. A portion of the protective coating that overlies the mask may be delineated from other portions of the protective coating; for example, by cutting, weakening or removing material from the protective coating at locations at or adjacent to the perimeter of the mask. The portion of the protective coating that overlies the mask, and the mask, may then be removed from the substrate.

    Abstract translation: 公开了一种用于将保护涂层施加到基底的选定部分的方法。 该方法包括将掩模施加到衬底的至少一部分上或者在未被保护涂层覆盖的衬底的至少一部分上形成掩模。 掩模可以通过将可流动材料施加到基底来选择性地形成。 或者,掩模可以由预制膜形成。 在面罩就位的情况下,可以将保护涂层施加到基板和面罩上。 覆盖在掩模上的一部分保护涂层可以从保护涂层的其他部分描绘出来; 例如通过在掩模周边处或附近的位置切割,削弱或去除保护涂层中的材料。 覆盖在掩模上的保护涂层部分和掩模然后可以从衬底上移除。

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