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    SELECTIVELY APPLYING A PROTECTIVE COATING TO ELECTRONIC COMPONENTS
    2.
    发明申请
    SELECTIVELY APPLYING A PROTECTIVE COATING TO ELECTRONIC COMPONENTS 审中-公开
    选择将保护涂层应用于电子元件

    公开(公告)号：WO2014110175A3

    公开(公告)日：2015-01-22

    申请号：PCT/US2014010739

    申请日：2014-01-08

    Applicant: HZO INC

    Inventor： COX DANA ,  SORENSON MAX ,  CHILD TYLER CHRISTENSEN ,  KASAGANI VIMAL KUMAR ,  LOOSE CAMERON LAMAR

    IPC: C23C14/04 ,  B05B15/04 ,  C23C16/04

    CPC classification number: B05C21/005 ,  B05C13/00 ,  B05D5/08 ,  C23C14/042 ,  C23C14/50 ,  C23C16/042 ,  C23C16/458 ,  H01L21/6715 ,  H01L21/67333 ,  H01L21/67724 ,  H01L21/682 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An apparatus for applying a protective coating to electronic device assemblies or other substrates may include a tray capable of holding multiple substrates. The tray can be selectively closed over the substrates. Lower and/or upper tray elements may include pre- formed masks thereon, which masks correspond to locations where protective coating materials should not adhere to the substrate. The masks may include a structural portion and a sealing portion. The structural portion may keep a substrate elevated to maintain an opening or channel through which protective coating materials may be applied to unmasked portions of the substrate. A sealing portion of the mask may engage the substrate to restrict flow of the protective coating material to the masked portion. Each tray may contain multiple substrates. A carrier may support multiple trays. Dozens and potentially hundreds of substrates may be carried by the carrier for simultaneous application of the protective coating.

    Abstract translation: 将保护涂层施加到电子器件组件或其它衬底的装置可以包括能够保持多个衬底的托盘。 托盘可以选择性地封闭在基板上。 下部和/或上部托盘元件可以包括其上的预先形成的掩模，其掩蔽对应于保护涂层材料不应该粘附到基底的位置。 掩模可以包括结构部分和密封部分。 结构部分可以保持衬底升高以保持开口或通道，保护涂层材料可以通过该开口或通道施加到衬底的未屏蔽部分。 掩模的密封部分可以与基底接合以限制保护涂层材料流到掩蔽部分。 每个托盘可以包含多个基板。 承运人可以支持多个托盘。 载体可能携带数十种可能数百种基材，以同时施加保护涂层。

    MASKING SUBSTRATES FOR APPLICATION OF PROTECTIVE COATINGS
    3.
    发明申请
    MASKING SUBSTRATES FOR APPLICATION OF PROTECTIVE COATINGS 审中-公开
    掩蔽基底以涂覆保护涂层

    公开(公告)号：WO2014110046A8

    公开(公告)日：2014-09-04

    申请号：PCT/US2014010526

    申请日：2014-01-07

    Applicant: HZO INC

    Inventor： ASTLE DAVID JAMES ,  CHILD TYLER CHRISTENSEN ,  KASAGANI VIMAL KUMAR ,  LOOSE CAMERON LAMAR ,  STEVENS BLAKE LEROY ,  SORENSON MAX ERNEST

    IPC: B05D1/32

    CPC classification number: B23K26/362 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/361 ,  B23K26/402 ,  B23K2203/50 ,  C23C14/042 ,  C23C16/042 ,  H01L21/561 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K3/285 ,  H05K3/288 ,  H05K2203/025 ,  H05K2203/092 ,  H05K2203/095 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/163 ,  H01L2924/00

    Abstract: A method for applying a protective coating to selected portions of a substrate is disclosed. The method includes applying a mask to or forming a mask on at least one portion of the substrate that is not to be covered with the protective coating. The mask may be selectively formed by applying a flowable material to the substrate. Alternatively, the mask may be formed from a preformed film. With the mask in place, the protective coating may be applied to the substrate and the mask. A portion of the protective coating that overlies the mask may be delineated from other portions of the protective coating; for example, by cutting, weakening or removing material from the protective coating at locations at or adjacent to the perimeter of the mask. The portion of the protective coating that overlies the mask, and the mask, may then be removed from the substrate.

    Abstract translation: 公开了一种用于将保护涂层施加到基底的选定部分的方法。 该方法包括将掩模施加到衬底的至少一部分上或者在未被保护涂层覆盖的衬底的至少一部分上形成掩模。 掩模可以通过将可流动材料施加到基底来选择性地形成。 或者，掩模可以由预制膜形成。 在面罩就位的情况下，可以将保护涂层施加到基板和面罩上。 覆盖在掩模上的一部分保护涂层可以从保护涂层的其他部分描绘出来; 例如通过在掩模周边处或附近的位置切割，削弱或去除保护涂层中的材料。 覆盖在掩模上的保护涂层部分和掩模然后可以从衬底上移除。

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