Invention Application
WO2015035016A3 HIGH CURRENT INTERCONNECT SYSTEM AND METHOD FOR USE IN A BATTERY MODULE
审中-公开
高电流互连系统和电池模块中使用的方法
- Patent Title: HIGH CURRENT INTERCONNECT SYSTEM AND METHOD FOR USE IN A BATTERY MODULE
- Patent Title (中): 高电流互连系统和电池模块中使用的方法
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Application No.: PCT/US2014054045Application Date: 2014-09-04
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Publication No.: WO2015035016A3Publication Date: 2015-04-23
- Inventor: SOLESKI EDWARD J , DEKEUSTER RICHARD M , THIEME BRYAN L , DULLE RONALD J , BALK MIKHAIL S
- Applicant: JOHNSON CONTROLS TECH CO
- Assignee: JOHNSON CONTROLS TECH CO
- Current Assignee: JOHNSON CONTROLS TECH CO
- Priority: US201361874472 2013-09-06
- Main IPC: G01R31/36
- IPC: G01R31/36 ; H01M2/10 ; H01M2/12 ; H01M2/20 ; H01M2/30 ; H01M10/42 ; H01M10/48 ; H01M10/613 ; H01M10/625 ; H01M10/647 ; H01R12/57 ; H01R12/71 ; H05K1/02 ; H05K1/18
Abstract:
A printed circuit board (PCB) assembly 58 may include a PCB 136 and a high current interconnect 140 mounted on the PCB 136. The high current interconnect 140 may be configured to electrically couple a first high current bladed component 153, a second high current bladed component 154, and a trace disposed on the PCB 136. The high current interconnect 140 may include feet 145 made of a conductive material that are coupled to the PCB 136. The trace may be coupled to the feet 148 via a weld.
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