公开(公告)号：WO2015035016A3

公开(公告)日：2015-04-23

申请号：PCT/US2014054045

申请日：2014-09-04

Applicant: JOHNSON CONTROLS TECH CO

Inventor： SOLESKI EDWARD J ,  DEKEUSTER RICHARD M ,  THIEME BRYAN L ,  DULLE RONALD J ,  BALK MIKHAIL S

IPC: G01R31/36 ,  H01M2/10 ,  H01M2/12 ,  H01M2/20 ,  H01M2/30 ,  H01M10/42 ,  H01M10/48 ,  H01M10/613 ,  H01M10/625 ,  H01M10/647 ,  H01R12/57 ,  H01R12/71 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1803 ,  B60L11/1851 ,  B60L11/1861 ,  B60L11/1864 ,  B60L11/1874 ,  B60L11/1877 ,  B60L11/1879 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/362 ,  G01R31/3627 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7016 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A printed circuit board (PCB) assembly 58 may include a PCB 136 and a high current interconnect 140 mounted on the PCB 136. The high current interconnect 140 may be configured to electrically couple a first high current bladed component 153, a second high current bladed component 154, and a trace disposed on the PCB 136. The high current interconnect 140 may include feet 145 made of a conductive material that are coupled to the PCB 136. The trace may be coupled to the feet 148 via a weld.

Abstract translation: 印刷电路板（PCB）组件58可以包括PCB 136和安装在PCB 136上的高电流互连140.高电流互连140可以被配置为将第一高电流叶片部件153，第二高电流叶片 部件154以及布置在PCB 136上的迹线。高电流互连140可以包括由导电材料制成的脚145，其耦合到PCB136。该迹线可以经由焊缝耦合到脚148。