Invention Application
WO2015112308A1 HIGH RESISTIVITY SOI WAFERS AND A METHOD OF MANUFACTURING THEREOF 审中-公开
高电阻SOI波形及其制造方法

HIGH RESISTIVITY SOI WAFERS AND A METHOD OF MANUFACTURING THEREOF
Abstract:
A high resistivity single crystal semiconductor handle structure for use in the manufacture of SOI structure is provided. The handle structure comprises an intermediate semiconductor layer between the handle substrate and the buried oxide layer. The intermediate semiconductor layer comprises a polycrystalline, amorphous, nanocrystalline, or monocrystalline structure and comprises a material selected from the group consisting of Si 1-x Ge x , Si 1-x C x , Si 1-x-y Ge x Sn y , Si 1-x-y-z Ge x Sn y C z , Ge 1-x Sn x , group IIIA-nitrides, semiconductor oxides, and any combination thereof.
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