Invention Application
WO2015130803A1 AUTOMATED INLINE INSPECTION AND METROLOGY USING SHADOW-GRAM IMAGES
审中-公开
自动化在线检查和使用阴影图像的方法
- Patent Title: AUTOMATED INLINE INSPECTION AND METROLOGY USING SHADOW-GRAM IMAGES
- Patent Title (中): 自动化在线检查和使用阴影图像的方法
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Application No.: PCT/US2015/017549Application Date: 2015-02-25
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Publication No.: WO2015130803A1Publication Date: 2015-09-03
- Inventor: VAJARIA, Himanshu , JAHANBIN, Sina , RIES, Bradley , MAHADEVAN, Mohan
- Applicant: KLA-TENCOR CORPORATION
- Applicant Address: Legal Department One Technology Drive Milpitas, California 95035 US
- Assignee: KLA-TENCOR CORPORATION
- Current Assignee: KLA-TENCOR CORPORATION
- Current Assignee Address: Legal Department One Technology Drive Milpitas, California 95035 US
- Agency: MCANDREWS, Kevin et al.
- Priority: US61/944,244 20140225; US14/630,252 20150224
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
Shadow-grams are used for edge inspection and metrology of a stacked wafer. The system includes a light source that directs collimated light at an edge of the stacked wafer, a detector opposite the light source, and a controller connected to the detector. The stacked wafer can rotate with respect to the light source. The controller analyzes a shadow-gram image of the edge of the stacked wafer. Measurements of a silhouette of the stacked wafer in the shadow-gram image are compared to predetermined measurements. Multiple shadow-gram images at different points along the edge of the stacked wafer can be aggregated and analyzed.
Information query
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