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    AUTOMATED INLINE INSPECTION AND METROLOGY USING SHADOW-GRAM IMAGES
    1.
    发明申请
    AUTOMATED INLINE INSPECTION AND METROLOGY USING SHADOW-GRAM IMAGES 审中-公开
    自动化在线检查和使用阴影图像的方法

    公开(公告)号：WO2015130803A1

    公开(公告)日：2015-09-03

    申请号：PCT/US2015/017549

    申请日：2015-02-25

    Applicant: KLA-TENCOR CORPORATION

    Inventor： VAJARIA, Himanshu ,  JAHANBIN, Sina ,  RIES, Bradley ,  MAHADEVAN, Mohan

    IPC: H01L21/66

    CPC classification number: G06T7/0004 ,  G01N21/9503 ,  G06K9/481 ,  G06K9/6204 ,  G06K2209/19 ,  G06T7/0006 ,  G06T7/13 ,  G06T7/62 ,  G06T2207/10024 ,  G06T2207/30148

    Abstract: Shadow-grams are used for edge inspection and metrology of a stacked wafer. The system includes a light source that directs collimated light at an edge of the stacked wafer, a detector opposite the light source, and a controller connected to the detector. The stacked wafer can rotate with respect to the light source. The controller analyzes a shadow-gram image of the edge of the stacked wafer. Measurements of a silhouette of the stacked wafer in the shadow-gram image are compared to predetermined measurements. Multiple shadow-gram images at different points along the edge of the stacked wafer can be aggregated and analyzed.

    Abstract translation: 阴影克用于堆叠晶片的边缘检查和计量。 该系统包括一个光源，它引导堆叠晶片的边缘处的准直光，与光源相对的检测器，以及连接到检测器的控制器。 堆叠的晶片可以相对于光源旋转。 控制器分析堆叠晶片边缘的阴影图像。 将影子图像中的堆叠晶片的轮廓的测量与预定的测量进行比较。 可以聚集和分析沿堆叠晶片边缘不同点的多个阴影图像。

    FEATURE SELECTION AND AUTOMATED PROCESS WINDOW MONITORING THROUGH OUTLIER DETECTION
    2.
    发明申请
    FEATURE SELECTION AND AUTOMATED PROCESS WINDOW MONITORING THROUGH OUTLIER DETECTION 审中-公开
    特征选择和自动化过程窗口监视通过OUTLIER DETECTION

    公开(公告)号：WO2017120370A1

    公开(公告)日：2017-07-13

    申请号：PCT/US2017/012382

    申请日：2017-01-05

    Applicant: KLA-TENCOR CORPORATION

    Inventor： GHADAR, Shabnam ,  JAHANBIN, Sina ,  VAJARIA, Himanshu ,  RIES, Bradley

    IPC: H01L21/66 ,  H01L21/67

    CPC classification number: G05B19/41875 ,  G05B2219/37224 ,  G06N99/005 ,  H01L22/12 ,  H01L22/20 ,  Y02P90/22

    Abstract: Feature extraction and classification is used for process window monitoring. A classifier, based on combinations of metrics of masked die images and including a set of significant combinations of one or more segment masks, metrics, and wafer images, is capable of detecting a process non-compliance. A process status can be determined using a classifier based on calculated metrics. The classifier may learn from nominal data.

    Abstract translation:

    特征提取和分类用于过程窗口监视。 基于掩蔽裸片图像的度量的组合并且包括一个或多个分段掩码，度量和晶片图像的一组重要组合的分类器能够检测过程不符合。 可以使用基于计算量度的分类器来确定过程状态。 分类器可以从名义数据中学习。

    AUTOMATED IMAGE-BASED PROCESS MONITORING AND CONTROL
    3.
    发明申请
    AUTOMATED IMAGE-BASED PROCESS MONITORING AND CONTROL 审中-公开
    自动化图像过程监控与控制

    公开(公告)号：WO2016176354A1

    公开(公告)日：2016-11-03

    申请号：PCT/US2016/029608

    申请日：2016-04-27

    Applicant: KLA-TENCOR CORPORATION

    Inventor： VAJARIA, Himanshu ,  GHADAR, Shabnam ,  TORELLI, Tommaso ,  RIES, Bradley ,  MAHADEVAN, Mohan ,  PANDEV, Stilian

    IPC: H01L21/66 ,  H01L21/027

    CPC classification number: H01L22/12 ,  H01L22/20

    Abstract: Methods and devices are disclosed for automated detection of a status of wafer fabrication process based on images. The methods advantageously use segment masks to enhance the signal-to-noise ratio of the images. Metrics are then calculated for the segment mask variations in order to determine one or more combinations of segment masks and metrics that are predictive of a process non-compliance. A model can be generated as a result of the process. In another embodiment, a method uses a model to monitor a process for compliance.

    Abstract translation: 公开了用于基于图像自动检测晶片制造过程的状态的方法和装置。 这些方法有利地使用段掩模来增强图像的信噪比。 然后针对段掩码变化计算度量，以便确定预测过程不符合性的段掩码和度量的一个或多个组合。 作为过程的结果可以生成模型。 在另一个实施例中，一种方法使用模型来监视合规性的过程。

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