公开(公告)号：WO2015130803A1

公开(公告)日：2015-09-03

申请号：PCT/US2015/017549

申请日：2015-02-25

Applicant: KLA-TENCOR CORPORATION

Inventor： VAJARIA, Himanshu ,  JAHANBIN, Sina ,  RIES, Bradley ,  MAHADEVAN, Mohan

IPC: H01L21/66

CPC classification number: G06T7/0004 ,  G01N21/9503 ,  G06K9/481 ,  G06K9/6204 ,  G06K2209/19 ,  G06T7/0006 ,  G06T7/13 ,  G06T7/62 ,  G06T2207/10024 ,  G06T2207/30148

Abstract: Shadow-grams are used for edge inspection and metrology of a stacked wafer. The system includes a light source that directs collimated light at an edge of the stacked wafer, a detector opposite the light source, and a controller connected to the detector. The stacked wafer can rotate with respect to the light source. The controller analyzes a shadow-gram image of the edge of the stacked wafer. Measurements of a silhouette of the stacked wafer in the shadow-gram image are compared to predetermined measurements. Multiple shadow-gram images at different points along the edge of the stacked wafer can be aggregated and analyzed.

Abstract translation: 阴影克用于堆叠晶片的边缘检查和计量。 该系统包括一个光源，它引导堆叠晶片的边缘处的准直光，与光源相对的检测器，以及连接到检测器的控制器。 堆叠的晶片可以相对于光源旋转。 控制器分析堆叠晶片边缘的阴影图像。 将影子图像中的堆叠晶片的轮廓的测量与预定的测量进行比较。 可以聚集和分析沿堆叠晶片边缘不同点的多个阴影图像。

公开(公告)号：WO2017120370A1

公开(公告)日：2017-07-13

申请号：PCT/US2017/012382

申请日：2017-01-05

Applicant: KLA-TENCOR CORPORATION

Inventor： GHADAR, Shabnam ,  JAHANBIN, Sina ,  VAJARIA, Himanshu ,  RIES, Bradley

IPC: H01L21/66 ,  H01L21/67

CPC classification number: G05B19/41875 ,  G05B2219/37224 ,  G06N99/005 ,  H01L22/12 ,  H01L22/20 ,  Y02P90/22

Abstract: Feature extraction and classification is used for process window monitoring. A classifier, based on combinations of metrics of masked die images and including a set of significant combinations of one or more segment masks, metrics, and wafer images, is capable of detecting a process non-compliance. A process status can be determined using a classifier based on calculated metrics. The classifier may learn from nominal data.

Abstract translation:

特征提取和分类用于过程窗口监视。 基于掩蔽裸片图像的度量的组合并且包括一个或多个分段掩码，度量和晶片图像的一组重要组合的分类器能够检测过程不符合。 可以使用基于计算量度的分类器来确定过程状态。 分类器可以从名义数据中学习。