Invention Application
- Patent Title: POLISHING PADS PRODUCED BY AN ADDITIVE MANUFACTURING PROCESS
- Patent Title (中): 由添加剂制造工艺生产的抛光垫
-
Application No.: PCT/US2015/056077Application Date: 2015-10-16
-
Publication No.: WO2016061544A1Publication Date: 2016-04-21
- Inventor: BAJAJ, Rajeev , REDFIELD, Daniel , ORILALL, Mahendra C. , FU, Boyi , KHANNA, Aniruddh Jagdish , FUNG, Jason G. , CORNEJO, Mario , CHOCKALINGAM, Ashwin , YAMAMURA, Mayu Felicia , KAKIREDDY, Raghava , KUMAR, Ashavani , HARIHARAN, Venkatachalam , MENK, Gregory E. , REDEKER, Fred C. , PATIBANDLA, Nag B. , NG, Hou Tee , DAVENPORT, Rob , SINHA, Amritanshu
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: 3050 Bowers Avenue Santa Clara, California 95054 US
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: 3050 Bowers Avenue Santa Clara, California 95054 US
- Agency: PATTERSON, B. Todd et al.
- Priority: US62/065,193 20141017; US62/065,270 20141017; US14/695,299 20150424
- Main IPC: H01L21/304
- IPC: H01L21/304
Abstract:
Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
Information query
IPC分类: