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    A THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS
    1.
    发明申请
    A THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS 审中-公开

    公开(公告)号：WO2018136694A1

    公开(公告)日：2018-07-26

    申请号：PCT/US2018/014344

    申请日：2018-01-19

    Applicant: APPLIED MATERIALS, INC.

    Inventor： TOLLES, Robert D. ,  MENK, Gregory E. ,  DAVEY, Eric ,  WANG, You ,  TRAN, Huyen Karen ,  REDEKER, Fred C. ,  KAKIREDDY, Veera Raghava Reddy ,  MIKHAYLICHENKO, Ekaterina ,  GURUSAMY, Jay

    IPC: B24B21/06 ,  B24B21/12 ,  B24B37/12 ,  B24B37/26 ,  B24D11/00

    Abstract: A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or "micro-features" and/or a plurality of grooves or "macro-features" formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.

    METHODS AND APPARATUS USING ENERGIZED FLUIDS TO CLEAN CHEMICAL MECHANICAL PLANARIZATION POLISHING PADS
    2.
    发明申请
    METHODS AND APPARATUS USING ENERGIZED FLUIDS TO CLEAN CHEMICAL MECHANICAL PLANARIZATION POLISHING PADS 审中-公开
    使用能量流体清洁化学机械平面抛光垫的方法和装置

    公开(公告)号：WO2014176242A1

    公开(公告)日：2014-10-30

    申请号：PCT/US2014/034959

    申请日：2014-04-22

    Applicant: APPLIED MATERIALS, INC

    Inventor： TANG, Jianshe ,  OSTERHELD, Thomas H. ,  REDEKER, Fred C. ,  MENK, Gregory E.

    IPC: H01L21/304

    CPC classification number: B24B53/017

    Abstract: Methods adapted to clean a chemical mechanical polishing (CMP) pad are disclosed. The methods include positioning an energized fluid delivery assembly over a CMP polishing pad; rotating the polishing pad on a platen; energizing a fluid within the energized fluid delivery assembly; applying the energized fluid to the polishing pad to dislodge slurry residue and debris; and removing the dislodged slurry residue and debris using a vacuum suction unit. Systems and apparatus for carrying out the methods are provided, as are numerous additional aspects.

    Abstract translation: 公开了适用于清洁化学机械抛光（CMP）垫的方法。 所述方法包括将激活的流体输送组件定位在CMP抛光垫上; 将抛光垫旋转在压板上; 激励通电流体输送组件内的流体; 将激活的流体施加到抛光垫以移除浆料残渣和碎屑; 并使用真空抽吸单元去除移出的浆料残渣和碎屑。 提供了用于执行方法的系统和装置，以及许多其它方面。

    POLISHING PADS PRODUCED BY AN ADDITIVE MANUFACTURING PROCESS
    4.
    发明申请
    POLISHING PADS PRODUCED BY AN ADDITIVE MANUFACTURING PROCESS 审中-公开
    添加剂制造工艺生产的抛光垫

    公开(公告)号：WO2016061585A1

    公开(公告)日：2016-04-21

    申请号：PCT/US2015/056254

    申请日：2015-10-19

    Applicant: APPLIED MATERIALS, INC.

    Inventor： BAJAJ, Rajeev ,  REDFIELD, Daniel ,  ORILALL, Mahendra C. ,  FU, Boyi ,  KHANNA, Aniruddh Jagdish ,  FUNG, Jason G. ,  CORNEJO, Mario ,  CHOCKALINGAM, Ashwin ,  YAMAMURA, Mayu Felicia ,  KAKIREDDY, Raghava ,  KUMAR, Ashavani ,  HARIHARAN, Venkatachalam ,  MENK, Gregory E. ,  REDEKER, Fred C. ,  PATIBANDLA, Nag B. ,  NG, Hou Tee ,  DAVENPORT, Rob ,  SINHA, Amritanshu

    IPC: H01L21/304

    CPC classification number: B24B37/26 ,  B24B37/22

    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

    Abstract translation: 本公开的实施例涉及具有可调化学，材料和结构特性的高级抛光垫以及制造该抛光垫的新方法。 根据本公开的一个或多个实施例，已经发现具有改进性能的抛光垫可以通过诸如三维（3D）印刷工艺的增材制造工艺来生产。 本公开的实施方式因此可以提供具有离散特征和几何形状的高级抛光垫，其由包括功能聚合物，官能低聚物，反应性稀释剂和固化剂的至少两种不同材料形成。 例如，高级抛光垫可以由多个聚合物层形成，通过自动顺序沉积至少一种树脂前体组合物，随后进行至少一个固化步骤，其中每个层可以代表至少一种聚合物组合物和/ 或不同成分的区域。

    CMP PAD CONSTRUCTION WITH COMPOSITE MATERIAL PROPERTIES USING ADDITIVE MANUFACTURING PROCESSES
    5.
    发明申请
    CMP PAD CONSTRUCTION WITH COMPOSITE MATERIAL PROPERTIES USING ADDITIVE MANUFACTURING PROCESSES 审中-公开
    使用添加剂制造工艺的具有复合材料特性的CMP PAD结构

    公开(公告)号：WO2016060712A1

    公开(公告)日：2016-04-21

    申请号：PCT/US2015/027473

    申请日：2015-04-24

    Applicant: APPLIED MATERIALS, INC.

    Inventor： BAJAJ, Rajeev ,  KRISHNAN, Kasiraman ,  ORILALL, Mahendra C. ,  REDFIELD, Daniel ,  REDEKER, Fred C. ,  PATIBANDLA, Nag B. ,  MENK, Gregory E. ,  FUNG, Jason G. ,  PERRY, Russell Edward ,  DAVENPORT, Robert E.

    IPC: H01L21/304

    CPC classification number: B24D18/00 ,  B24D3/28 ,  B33Y10/00 ,  B33Y80/00

    Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

    Abstract translation: 本公开的实施例通常提供抛光垫，其包括复合衬垫本体和用于形成抛光垫的方法。 一个实施例提供了一种包括复合衬垫本体的抛光垫。 复合衬垫本体包括由第一材料或第一组合材料形成的一个或多个第一特征以及由第二材料或第二材料组合物形成的一个或多个第二特征，其中所述一个或多个第一特征和一个 或更多的第二特征通过沉积多个层而形成，所述多个层包括第一材料或第一材料组合物和第二材料或第二材料组合物。

    CLOSED-LOOP CONTROL OF CMP SLURRY FLOW
    6.
    发明申请
    CLOSED-LOOP CONTROL OF CMP SLURRY FLOW 审中-公开
    CMP浆液流动的闭环控制

    公开(公告)号：WO2012005939A2

    公开(公告)日：2012-01-12

    申请号：PCT/US2011/041255

    申请日：2011-06-21

    Applicant: APPLIED MATERIALS, INC. ,  MENK, Gregory E. ,  TSAI, Stan D. ,  CHO, Sang J. ,  DHANDAPANI, Sivakumar

    Inventor： MENK, Gregory E. ,  TSAI, Stan D. ,  CHO, Sang J. ,  DHANDAPANI, Sivakumar

    IPC: H01L21/304

    CPC classification number: B24B37/26 ,  B24B37/005 ,  B24B37/042 ,  B24B57/02

    Abstract: Embodiments of the present invention generally relate to methods for chemical mechanical polishing a substrate. The methods generally include measuring the thickness of a polishing pad having grooves or other slurry transport features on a polishing surface. Once the depth of the grooves on the polishing surface is determined, a flow rate of a polishing slurry is adjusted in response to the determined groove depth. A predetermined number of substrates are polished on the polishing surface. The method can then optionally be repeated.

    Abstract translation: 本发明的实施方案通常涉及用于化学机械抛光基底的方法。 所述方法通常包括在研磨表面上测量具有凹槽或其它浆料输送特征的抛光垫的厚度。 一旦确定了抛光表面上的凹槽的深度，则根据所确定的凹槽深度来调整抛光浆料的流速。 在抛光表面上抛光预定数量的基板。 然后可以可选地重复该方法。

    POLISHING PADS PRODUCED BY AN ADDITIVE MANUFACTURING PROCESS
    9.
    发明申请
    POLISHING PADS PRODUCED BY AN ADDITIVE MANUFACTURING PROCESS 审中-公开
    由添加剂制造工艺生产的抛光垫

    公开(公告)号：WO2016061544A1

    公开(公告)日：2016-04-21

    申请号：PCT/US2015/056077

    申请日：2015-10-16

    Applicant: APPLIED MATERIALS, INC.

    Inventor： BAJAJ, Rajeev ,  REDFIELD, Daniel ,  ORILALL, Mahendra C. ,  FU, Boyi ,  KHANNA, Aniruddh Jagdish ,  FUNG, Jason G. ,  CORNEJO, Mario ,  CHOCKALINGAM, Ashwin ,  YAMAMURA, Mayu Felicia ,  KAKIREDDY, Raghava ,  KUMAR, Ashavani ,  HARIHARAN, Venkatachalam ,  MENK, Gregory E. ,  REDEKER, Fred C. ,  PATIBANDLA, Nag B. ,  NG, Hou Tee ,  DAVENPORT, Rob ,  SINHA, Amritanshu

    IPC: H01L21/304

    CPC classification number: B24B37/26 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  B24D18/0045 ,  B29C64/112 ,  B33Y80/00

    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

    Abstract translation: 本公开的实施例涉及具有可调节的化学，材料和结构特性的高级抛光垫及其制造方法。 根据本公开的一个或多个实施例，已经发现可以通过诸如三维（3D）印刷工艺的添加剂制造工艺来生产具有改进性能的抛光垫。 因此，本公开的实施例可以提供具有离散特征和几何形状的先进抛光垫，其由至少两种不同的材料形成，包括功能聚合物，功能性低聚物，反应性稀释剂和固化剂。 例如，先进的抛光垫可以由多个聚合物层形成，通过至少一种树脂前体组合物的自动顺序沉积，然后至少一个固化步骤，其中各层可代表至少一种聚合物组合物和/ 或不同组成的区域。

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