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    POLISHING PADS FOR HIGH TEMPERATURE PROCESSING
    1.
    发明申请
    POLISHING PADS FOR HIGH TEMPERATURE PROCESSING 审中-公开

    公开(公告)号：WO2023038800A1

    公开(公告)日：2023-03-16

    申请号：PCT/US2022/041346

    申请日：2022-08-24

    Applicant: APPLIED MATERIALS, INC.

    Inventor： GANAPATHIAPPAN, Sivapackia ,  BAJAJ, Rajeev ,  LUO, Yingdong ,  KHANNA, Aniruddh Jagdish ,  WANG, You ,  REDFIELD, Daniel

    IPC: B24B37/24 ,  B24B37/04

    Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements. Each polishing element comprises an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface to define a plurality of channels disposed between the polishing elements. Each of the polishing elements has a plurality of pore-features formed therein. Each of the polishing elements is formed of a pre- polymer composition and a sacrificial material composition. In some cases, a sample of the cured pre-polymer composition has a glass transition temperature (Tg) of about 80 °C or greater. A storage modulus (E') of the cured pre-polymer composition at a temperature of 80 °C (E'80) can be about 200 MPa or greater.

    HYDROPHOBIC AND ICEPHOBIC COATING
    2.
    发明申请
    HYDROPHOBIC AND ICEPHOBIC COATING 审中-公开

    公开(公告)号：WO2020190441A1

    公开(公告)日：2020-09-24

    申请号：PCT/US2020/018886

    申请日：2020-02-19

    Applicant: APPLIED MATERIALS, INC.

    Inventor： BAJAJ, Rajeev ,  CHANG, Mei ,  PADHI, Deenesh

    IPC: C03C17/245 ,  C23C16/30 ,  B60J1/00

    Abstract: A method of depositing a coating and a layered structure is provided. A coating is deposited on a substrate to make a layered structure, such that an interface between the coating and the substrate is formed. The coating includes silicon, oxygen, and carbon, where the carbon doping in the coating increases between the interface and the top surface of the coating. The top surface of the coating is inherently hydrophobic and icephobic, and reduces the wetting of water or ice film on the layered structure, without requiring reapplication of the coating.

    CHEMICAL MECHANICAL POLISHING PAD WITH INTERNAL CHANNELS
    6.
    发明申请
    CHEMICAL MECHANICAL POLISHING PAD WITH INTERNAL CHANNELS 审中-公开
    具有内部通道的化学机械抛光垫

    公开(公告)号：WO2016057075A1

    公开(公告)日：2016-04-14

    申请号：PCT/US2015/027537

    申请日：2015-04-24

    Applicant: APPLIED MATERIALS, INC.

    Inventor： FUNG, Jason G. ,  BAJAJ, Rajeev ,  KRISHNAN, Kasiraman ,  ORILALL, Mahendra C. ,  REDEKER, Fred C. ,  PERRY, Russell Edward ,  MENK, Gregory E. ,  REDFIELD, Daniel

    IPC: H01L21/304 ,  H01L21/683

    CPC classification number: B24B37/26 ,  B24B37/015 ,  B24B55/02

    Abstract: A polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a supporting surface. The polishing pad further includes a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface. The polishing pad further includes one or more channels formed in an interior region of the polishing pad and extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port.

    Abstract translation: 提供了用于化学机械抛光的抛光垫。 抛光垫包括具有支撑表面的基底区域。 抛光垫还包括形成抛光表面的多个抛光特征，抛光表面与支撑表面相对。 抛光垫还包括形成在抛光垫的内部区域中并且至少部分地围绕抛光垫的中心延伸的一个或多个通道，其中每个通道流体地联接到至少一个端口。

    METHODS AND APPARATUS FOR CONDITIONING OF CHEMICAL MECHANICAL POLISHING PADS
    7.
    发明申请
    METHODS AND APPARATUS FOR CONDITIONING OF CHEMICAL MECHANICAL POLISHING PADS 审中-公开
    化学机械抛光垫调节方法与装置

    公开(公告)号：WO2014113108A1

    公开(公告)日：2014-07-24

    申请号：PCT/US2013/065604

    申请日：2013-10-18

    Applicant: APPLIED MATERIALS, INC.

    Inventor： BAJAJ, Rajeev ,  CHEN, Hung Chih

    IPC: H01L21/304

    CPC classification number: B24B53/017 ,  B24B37/34

    Abstract: A method and apparatus for conditioning a polishing pad is provided. In one embodiment, a pad conditioning device for a substrate polishing process is provided. The pad conditioning device includes an optical device coupled to a portion of a polishing station adjacent a polishing pad, the optical device comprising a laser emitter adapted to emit a beam toward a polishing surface of the polishing pad, the beam having a wavelength range that is substantially non-reactive with a polishing fluid utilized in the polishing process, but is reactive with the polishing pad.

    Abstract translation: 提供了一种用于调理抛光垫的方法和装置。 在一个实施例中，提供了一种用于衬底抛光工艺的衬垫调节装置。 焊盘调节装置包括耦合到抛光站的与抛光垫相邻的部分的光学装置，该光学装置包括适于向抛光垫的抛光表面发射光束的激光发射器，该光束的波长范围为 与抛光过程中使用的抛光液基本上不反应，但与抛光垫反应。

    IMPROVED RETAINING RING DESIGN
    8.
    发明申请
    IMPROVED RETAINING RING DESIGN 审中-公开

    公开(公告)号：WO2022040459A1

    公开(公告)日：2022-02-24

    申请号：PCT/US2021/046760

    申请日：2021-08-19

    Applicant: APPLIED MATERIALS, INC.

    Inventor： KHANNA, Aniruddh Jagdish ,  REDFIELD, Daniel ,  CHATOW, Ehud ,  MASON, Kenneth ,  TURNER, Steven ,  BAJAJ, Rajeev ,  RYNNE, Kieran Joseph ,  GOPALAN, Periya G.

    IPC: B24B37/32 ,  B24B37/10 ,  H01L21/67

    Abstract: The present disclosure relates to retaining rings that include tunable chemical, material and structural properties, improved structural and fluid transport configurations and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a retaining ring with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure provide an advanced retaining ring that has discrete features and geometries, formed from at least two different materials that are formed from one or more polymers. The layers and/or regions of the advanced retaining ring may include a composite material structure, such as a polymer that contains at least one filler, such as metals, semimetal oxides, carbides, nitrides and/or polymer particles.

    INTEGRATING 3D PRINTING INTO MULTI-PROCESS FABRICATION SCHEMES
    9.
    发明申请
    INTEGRATING 3D PRINTING INTO MULTI-PROCESS FABRICATION SCHEMES 审中-公开

    公开(公告)号：WO2019190676A1

    公开(公告)日：2019-10-03

    申请号：PCT/US2019/019669

    申请日：2019-02-26

    Applicant: APPLIED MATERIALS, INC.

    Inventor： MCCLINTOCK, William H. ,  BAJAJ, Rajeev ,  FUNG, Jason G. ,  REDFIELD, Daniel

    IPC: H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L23/485 ,  B29C64/393 ,  B29C64/30 ,  B29C64/106 ,  B33Y50/02 ,  B33Y80/00

    Abstract: Embodiments disclosed herein provide methods of forming bond pad redistribution layers (RDLs) in a fan-out wafer level packaging (FOWLP) scheme using an additive manufacturing process. In one embodiment, a method of forming a redistribution layer includes positioning a carrier substrate on a manufacturing support of an additive manufacturing system, the carrier substrate including a plurality of singulated devices, detecting one or more fiducial features corresponding to each of the plurality of singulated devices, determining actual positions of each of the plurality of singulated devices relative to one or more components of the additive manufacturing system, generating printing instructions for forming a patterned dielectric layer based on the actual positions of each of the plurality of singulated devices, and forming the patterned dielectric layer using the printing instructions.

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