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    POLISHING PADS FORMED USING AN ADDITIVE MANUFACTURING PROCESS AND METHODS RELATED THERETO
    1.
    发明申请
    POLISHING PADS FORMED USING AN ADDITIVE MANUFACTURING PROCESS AND METHODS RELATED THERETO 审中-公开

    公开(公告)号：WO2020153979A1

    公开(公告)日：2020-07-30

    申请号：PCT/US2019/024999

    申请日：2019-03-29

    Applicant: APPLIED MATERIALS, INC.

    Inventor： CHOCKALINGAM, Ashwin ,  FUNG, Jason G. ,  GANAPATHIAPPAN, Sivapackia ,  BAJAJ, Rajeev ,  REDFIELD, Daniel

    IPC: B24D3/28 ,  B24D3/34

    Abstract: Embodiments of the present disclosure generally relate to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical mechanical polishing (CMP) process in the manufacture of semiconductor devices. The polishing pads described herein feature a continuous polymer phase of polishing pad material comprising one or more first material domains and a plurality of second material domains. The one or more first material domains are formed of a polymerized reaction product of a first pre-polymer composition, the plurality of second material domains are formed of a polymerized reaction product of a second pre-polymer composition, the second pre-polymer composition is different from the first pre-polymer composition, and interfacial regions between the one or more first material domains and the plurality of second material are formed of a co-polymerized reaction product of the first pre-polymer composition and the second pre-polymer composition.

    PAD STRUCTURE AND FABRICATION METHODS
    2.
    发明申请
    PAD STRUCTURE AND FABRICATION METHODS 审中-公开
    垫结构和制造方法

    公开(公告)号：WO2017155969A1

    公开(公告)日：2017-09-14

    申请号：PCT/US2017/021119

    申请日：2017-03-07

    Applicant: APPLIED MATERIALS, INC.

    Inventor： NG, Hou T. ,  PATIBANDLA, Nag B. ,  BAJAJ, Rajeev ,  REDFIELD, Daniel ,  CHOCKALINGAM, Ashwin ,  YAMAMURA, Mayu ,  CORNEJO, Mario

    IPC: H01L21/306 ,  H01L21/304 ,  H01L21/321 ,  H01L21/02

    CPC classification number: B33Y10/00 ,  B24B37/22 ,  B29K2105/0058 ,  B33Y30/00 ,  B33Y80/00 ,  G03F7/0035 ,  G03F7/2014

    Abstract: A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.

    Abstract translation: 提供了用于制造用于抛光工艺的抛光制品的方法和设备。 在一个实施方式中，提供了一种形成抛光垫的方法。 该方法包括在衬底上沉积未固化的第一层形成光刻胶的光聚合物。 该方法还包括将第一光学掩模定位在未固化的焊盘形成光聚合物的第一层上。 第一光学掩模包括具有至少一个孔的图案化片材。 该方法还包括将未固化的形成光聚合物的垫的第一层暴露于电磁辐射，以选择性地聚合形成光聚合物的垫的未固化的第一层的曝光部分，以在形成第一垫的光聚合物层内形成垫支撑结构。 >

    METHOD AND APPARATUS FOR FORMING ADVANCED POLISHING PADS USING AN ADDITIVE MANUFACTURING PROCESS
    3.
    发明申请
    METHOD AND APPARATUS FOR FORMING ADVANCED POLISHING PADS USING AN ADDITIVE MANUFACTURING PROCESS 审中-公开
    使用添加剂制造工艺形成先进抛光垫的方法和设备

    公开(公告)号：WO2017066077A1

    公开(公告)日：2017-04-20

    申请号：PCT/US2016/055793

    申请日：2016-10-06

    Applicant: APPLIED MATERIALS, INC.

    Inventor： GANAPATHIAPPAN, Sivapackia ,  FU, Boyi ,  CHOCKALINGAM, Ashwin ,  REDFIELD, Daniel ,  BAJAJ, Rajeev ,  ORILALL, Mahendra C. ,  NG, Hou T. ,  FUNG, Jason G. ,  YAMAMURA, Mayu

    IPC: B24D11/00 ,  B24D3/28 ,  B24B37/24 ,  B33Y10/00 ,  B24B37/26 ,  B24D11/04 ,  B24B37/22 ,  B33Y80/00 ,  B24D18/00

    CPC classification number: B24B37/22 ,  B24B37/24 ,  B33Y10/00 ,  B33Y80/00

    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

    Abstract translation: 本公开的实施例涉及具有可调化学，材料和结构特性的高级抛光垫以及制造该抛光垫的新方法。 根据本公开的一个或多个实施例，已经发现具有改进性能的抛光垫可以通过诸如三维（3D）印刷工艺的增材制造工艺来生产。 本发明的实施例因此可以提供具有离散特征和几何形状的高级抛光垫，其由包括功能聚合物，官能低聚物，反应性稀释剂，加成聚合物前体化合物，催化剂和固化剂的至少两种不同材料形成。 例如，高级抛光垫可以由多个聚合物层形成，通过自动顺序沉积至少一种聚合物前体组合物，随后进行至少一个固化步骤，其中每个层可以代表至少一种聚合物组合物和/ 或不同成分的区域。 本公开的实施方式进一步提供了具有聚合物层的抛光垫，所述聚合物层可以是互穿聚合物网络。

    POLISHING PADS FOR HIGH TEMPERATURE PROCESSING
    5.
    发明申请
    POLISHING PADS FOR HIGH TEMPERATURE PROCESSING 审中-公开

    公开(公告)号：WO2023038800A1

    公开(公告)日：2023-03-16

    申请号：PCT/US2022/041346

    申请日：2022-08-24

    Applicant: APPLIED MATERIALS, INC.

    Inventor： GANAPATHIAPPAN, Sivapackia ,  BAJAJ, Rajeev ,  LUO, Yingdong ,  KHANNA, Aniruddh Jagdish ,  WANG, You ,  REDFIELD, Daniel

    IPC: B24B37/24 ,  B24B37/04

    Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements. Each polishing element comprises an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface to define a plurality of channels disposed between the polishing elements. Each of the polishing elements has a plurality of pore-features formed therein. Each of the polishing elements is formed of a pre- polymer composition and a sacrificial material composition. In some cases, a sample of the cured pre-polymer composition has a glass transition temperature (Tg) of about 80 °C or greater. A storage modulus (E') of the cured pre-polymer composition at a temperature of 80 °C (E'80) can be about 200 MPa or greater.

    CHEMICAL MECHANICAL POLISHING PAD WITH INTERNAL CHANNELS
    9.
    发明申请
    CHEMICAL MECHANICAL POLISHING PAD WITH INTERNAL CHANNELS 审中-公开
    具有内部通道的化学机械抛光垫

    公开(公告)号：WO2016057075A1

    公开(公告)日：2016-04-14

    申请号：PCT/US2015/027537

    申请日：2015-04-24

    Applicant: APPLIED MATERIALS, INC.

    Inventor： FUNG, Jason G. ,  BAJAJ, Rajeev ,  KRISHNAN, Kasiraman ,  ORILALL, Mahendra C. ,  REDEKER, Fred C. ,  PERRY, Russell Edward ,  MENK, Gregory E. ,  REDFIELD, Daniel

    IPC: H01L21/304 ,  H01L21/683

    CPC classification number: B24B37/26 ,  B24B37/015 ,  B24B55/02

    Abstract: A polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a supporting surface. The polishing pad further includes a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface. The polishing pad further includes one or more channels formed in an interior region of the polishing pad and extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port.

    Abstract translation: 提供了用于化学机械抛光的抛光垫。 抛光垫包括具有支撑表面的基底区域。 抛光垫还包括形成抛光表面的多个抛光特征，抛光表面与支撑表面相对。 抛光垫还包括形成在抛光垫的内部区域中并且至少部分地围绕抛光垫的中心延伸的一个或多个通道，其中每个通道流体地联接到至少一个端口。

    POLISHING PADS HAVING IMPROVED PORE STRUCTURE
    10.
    发明申请
    POLISHING PADS HAVING IMPROVED PORE STRUCTURE 审中-公开

    公开(公告)号：WO2022245404A1

    公开(公告)日：2022-11-24

    申请号：PCT/US2022/013292

    申请日：2022-01-21

    Applicant: APPLIED MATERIALS, INC.

    Inventor： GANAPATHIAPPAN, Sivapackia ,  SRIDHAR, Uma ,  LUO, Yingdong ,  CHOCKALINGAM, Ashwin ,  YAMAMURA, Mayu ,  ROZO, Sebastian David ,  REDFIELD, Daniel ,  BAJAJ, Rajeev ,  PATIBANDLA, Nag B. ,  NG, Hou T. ,  MADHUSOODHANAN, Sudhakar

    IPC: B24D11/00 ,  B24B37/24

    Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A method of forming a polishing pad includes (a) dispensing droplets of a pre-polymer composition and droplets of a sacrificial material composition onto a surface of a previously formed print layer according to a predetermined droplet dispense pattern. The method includes (b) at least partially curing the dispensed droplets of the pre-polymer composition to form a print layer. The method includes (c) sequentially repeating (a) and (b) to form a polishing layer having a plurality of pore- features formed therein. The pre-polymer composition includes a multifunctional acrylate component. A curing rate of the dispensed droplets of the pre-polymer composition including the multifunctional acrylate component when exposed to a first dose of electromagnetic radiation is greater than a curing rate of the pre-polymer composition without the multifunctional acrylate component when exposed to the same first dose of electromagnetic radiation.

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