Invention Application
WO2017066077A1 METHOD AND APPARATUS FOR FORMING ADVANCED POLISHING PADS USING AN ADDITIVE MANUFACTURING PROCESS
审中-公开
使用添加剂制造工艺形成先进抛光垫的方法和设备
- Patent Title: METHOD AND APPARATUS FOR FORMING ADVANCED POLISHING PADS USING AN ADDITIVE MANUFACTURING PROCESS
- Patent Title (中): 使用添加剂制造工艺形成先进抛光垫的方法和设备
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Application No.: PCT/US2016/055793Application Date: 2016-10-06
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Publication No.: WO2017066077A1Publication Date: 2017-04-20
- Inventor: GANAPATHIAPPAN, Sivapackia , FU, Boyi , CHOCKALINGAM, Ashwin , REDFIELD, Daniel , BAJAJ, Rajeev , ORILALL, Mahendra C. , NG, Hou T. , FUNG, Jason G. , YAMAMURA, Mayu
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: 3050 Bowers Avenue Santa Clara, CA 95054 US
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: 3050 Bowers Avenue Santa Clara, CA 95054 US
- Agency: PATTERSON, B. Todd et al.
- Priority: US14/885,950 20151016; US14/887,240 20151019; US14/920,801 20151022; US62/280,537 20160119; US15/002,384 20160120; US62/304,134 20160304; US62/323,599 20160415; US62/331,234 20160503; US62/339,807 20160521; US62/380,015 20160826; US62/380,334 20160826
- Main IPC: B24D11/00
- IPC: B24D11/00 ; B24D3/28 ; B24B37/24 ; B33Y10/00 ; B24B37/26 ; B24D11/04 ; B24B37/22 ; B33Y80/00 ; B24D18/00
Abstract:
Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.
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