Invention Application
WO2017127221A1 POROUS CHEMICAL MECHANICAL POLISHING PADS 审中-公开
多孔化学机械抛光垫

POROUS CHEMICAL MECHANICAL POLISHING PADS
Abstract:
Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
Patent Agency Ranking
0/0