Invention Application
- Patent Title: POROUS CHEMICAL MECHANICAL POLISHING PADS
- Patent Title (中): 多孔化学机械抛光垫
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Application No.: PCT/US2016/069193Application Date: 2016-12-29
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Publication No.: WO2017127221A1Publication Date: 2017-07-27
- Inventor: GANAPATHIAPPAN, Sivapackia , PATIBANDLA, Nag B. , BAJAJ, Rajeev , REDFIELD, Daniel , REDEKER, Fred C. , ORILALL, Mahendra C. , FU, Boyi , YAMAMURA, Mayu , CHOCKALINGAM, Ashwin
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: 3050 Bowers Avenue Santa Clara, California 95054 US
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: 3050 Bowers Avenue Santa Clara, California 95054 US
- Agency: PATTERSON, B. Todd et al.
- Priority: US62/280,537 20160119; US62/331,234 20160503; US62/380,015 20160826
- Main IPC: B24D18/00
- IPC: B24D18/00 ; B24B3/28 ; B24B37/22 ; B24B37/24 ; C08J9/06 ; C08J9/14
Abstract:
Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
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