Invention Application
WO2017146739A1 PRESSURE AND LOAD MEASUREMENT FOR SILICON DIE THERMAL SOLUTION ATTACHMENT
审中-公开
硅芯片热模量附件的压力和负载测量
- Patent Title: PRESSURE AND LOAD MEASUREMENT FOR SILICON DIE THERMAL SOLUTION ATTACHMENT
- Patent Title (中): 硅芯片热模量附件的压力和负载测量
-
Application No.: PCT/US2016/019964Application Date: 2016-02-26
-
Publication No.: WO2017146739A1Publication Date: 2017-08-31
- Inventor: YAGNAMURTHY, Naga Sivakumar , GEBREHIWOT, Betsegaw , HARIRCHIAN, Tannaz , PETRINI, Joseph B. , DEVASENATHIPATHY, Shankar , REYNOLDS, Seth B. , MALATKAR, Pramod
- Applicant: INTEL CORPORATION
- Applicant Address: 2200 Mission College Boulevard Santa Clara, California 95054 US
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: 2200 Mission College Boulevard Santa Clara, California 95054 US
- Agency: VAN NESS, Mark C. et al.
- Main IPC: G01L25/00
- IPC: G01L25/00
Abstract:
Embodiments are generally directed to pressure and load measurement for silicon die thermal solution attachment. An embodiment of a calibration machine includes: a base; a first post and a second post, a first end of each of the posts being coupled with the base; a set of fixtures, a first fixture being coupled with the first post and second post and a second fixture being moveable coupled with the first post and the second post; an actuator, the actuator being coupled with the first fixture and being operable to provide force on the second fixture; a load cell coupled with the base; and one or more calibration stages on the load cell and below the set of fixtures.
Information query