公开(公告)号：WO2018118279A1

公开(公告)日：2018-06-28

申请号：PCT/US2017/061653

申请日：2017-11-15

Applicant: INTEL CORPORATION

Inventor： EID, Feras ,  ABAZARNIA, Nader N. ,  SWAN, Johanna M. ,  BEASLEY, Taesha D. ,  OSTER, Sasha N. ,  HARIRCHIAN, Tannaz ,  LIFF, Shawna M.

IPC: H01L23/28 ,  H01L25/07 ,  H01L23/12 ,  H01L23/485 ,  H01L21/56

Abstract: An embodiment includes an apparatus comprising: a semiconductor die; package molding that is molded onto and conformal with a first die surface of the semiconductor die and at least two sidewalls of the semiconductor die, the package molding including: (a)(i) a first surface contacting the semiconductor die, (a)(ii) a second surface opposite the first surface, and (a)(iii) an aperture that extends from the first surface to the second surface; and a polymer substantially filling the aperture; wherein the package molding includes a first thermal conductivity (watts per meter kelvin (W/(m•K)) and the polymer includes a second thermal conductivity that is greater than the first thermal conductivity. Other embodiments are described herein.

公开(公告)号：WO2016159944A1

公开(公告)日：2016-10-06

申请号：PCT/US2015/023182

申请日：2015-03-27

Applicant: INTEL CORPORATION

Inventor： KRAJNIAK, Jan ,  HARIRCHIAN, Tannaz ,  LOFGREEN, Kelly P. ,  MATAYABAS JR., James C. ,  RARAVIKAR, Nachiket R. ,  SANKMAN, Robert L.

IPC: H01L23/34 ,  H01L23/36

CPC classification number: H01L23/427 ,  C09K5/02 ,  H01L21/77 ,  H01L23/373 ,  H01L23/3737 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/00

Abstract: Embodiments of the present disclosure describe an energy storage material for thermal management and associated techniques and configurations. In one embodiment, an energy storage material may include an organic matrix and a solid-solid phase change material dispersed in the organic matrix, the solid-solid phase change material to change crystalline structure and absorb heat while remaining a solid at a threshold temperature associated with operation of an integrated circuit (IC) die. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例描述了用于热管理和相关联的技术和配置的能量存储材料。 在一个实施方案中，能量存储材料可以包括分散在有机基质中的有机基质和固体 - 固相变材料，所述固 - 固相变材料改变晶体结构并吸收热量，同时在相关的阈值温度保持固体 具有集成电路（IC）芯片的操作。 可以描述和/或要求保护其他实施例。

公开(公告)号：WO2017146739A1

公开(公告)日：2017-08-31

申请号：PCT/US2016/019964

申请日：2016-02-26

Applicant: INTEL CORPORATION

Inventor： YAGNAMURTHY, Naga Sivakumar ,  GEBREHIWOT, Betsegaw ,  HARIRCHIAN, Tannaz ,  PETRINI, Joseph B. ,  DEVASENATHIPATHY, Shankar ,  REYNOLDS, Seth B. ,  MALATKAR, Pramod

IPC: G01L25/00

CPC classification number: G01L25/00

Abstract: Embodiments are generally directed to pressure and load measurement for silicon die thermal solution attachment. An embodiment of a calibration machine includes: a base; a first post and a second post, a first end of each of the posts being coupled with the base; a set of fixtures, a first fixture being coupled with the first post and second post and a second fixture being moveable coupled with the first post and the second post; an actuator, the actuator being coupled with the first fixture and being operable to provide force on the second fixture; a load cell coupled with the base; and one or more calibration stages on the load cell and below the set of fixtures.

Abstract translation: 实施例通常针对硅芯片热解决方案附件的压力和负载测量。 校准机器的一个实施例包括：基座; 第一柱和第二柱，每个所述柱的第一端与所述基部连接; 一组固定装置，与第一支柱和第二支柱连接的第一固定装置以及与第一支柱和第二支柱可移动连接的第二固定装置; 致动器，所述致动器与所述第一固定装置联接并且可操作以在所述第二固定装置上提供力; 与基座连接的测力传感器; 以及称重传感器上的一个或多个校准阶段以及一组固定装置之下。

公开(公告)号：WO2014051714A1

公开(公告)日：2014-04-03

申请号：PCT/US2013/044001

申请日：2013-06-04

Applicant: INTEL CORPORATION

Inventor： TEH, Weng Hong ,  KULKARNI, Deepak ,  CHIU, Chia-Pin ,  HARIRCHIAN, Tannaz ,  GUZEK, John, S.

IPC: H01L23/36 ,  H01L23/48 ,  H01L23/12

CPC classification number: H01L24/20 ,  H01L21/56 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/18 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/211 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/00

Abstract: An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a heat spreader having a lower heat spreader surface, an upper heat spreader surface parallel to the lower heat spreader surface, and at least one heat spreader side, the heat spreader disposed on the upper surface of the microelectronic die in thermal communication with the inactive region of the die and electrically insulated from the active region. The example optionally includes an encapsulation material encapsulating the die side and the heat spreader side and lower heat spreader surface, the encapsulation material including a lower surface substantially parallel to the die lower surface and an upper surface substantially parallel to the die upper surface.

Abstract translation: 一个实例包括包括具有下模表面的微电子管芯，平行于下模表面的上模表面和管芯侧的管芯封装，该微电子管芯包括有源区和非活性区。 该实施例可选地包括具有较低散热器表面的散热器，平行于下部散热器表面的上部散热器表面和至少一个散热器侧，散热器布置在热电连接的微电子管芯的上表面上 具有裸片的非活性区域并与活性区电绝缘。 该实施例可选地包括封装模具侧和散热器侧和下部散热器表面的封装材料，该封装材料包括基本上平行于模具下表面的下表面和基本上平行于模具上表面的上表面。