公开(公告)号：WO2017146739A1

公开(公告)日：2017-08-31

申请号：PCT/US2016/019964

申请日：2016-02-26

Applicant: INTEL CORPORATION

Inventor： YAGNAMURTHY, Naga Sivakumar ,  GEBREHIWOT, Betsegaw ,  HARIRCHIAN, Tannaz ,  PETRINI, Joseph B. ,  DEVASENATHIPATHY, Shankar ,  REYNOLDS, Seth B. ,  MALATKAR, Pramod

IPC: G01L25/00

CPC classification number: G01L25/00

Abstract: Embodiments are generally directed to pressure and load measurement for silicon die thermal solution attachment. An embodiment of a calibration machine includes: a base; a first post and a second post, a first end of each of the posts being coupled with the base; a set of fixtures, a first fixture being coupled with the first post and second post and a second fixture being moveable coupled with the first post and the second post; an actuator, the actuator being coupled with the first fixture and being operable to provide force on the second fixture; a load cell coupled with the base; and one or more calibration stages on the load cell and below the set of fixtures.

Abstract translation: 实施例通常针对硅芯片热解决方案附件的压力和负载测量。 校准机器的一个实施例包括：基座; 第一柱和第二柱，每个所述柱的第一端与所述基部连接; 一组固定装置，与第一支柱和第二支柱连接的第一固定装置以及与第一支柱和第二支柱可移动连接的第二固定装置; 致动器，所述致动器与所述第一固定装置联接并且可操作以在所述第二固定装置上提供力; 与基座连接的测力传感器; 以及称重传感器上的一个或多个校准阶段以及一组固定装置之下。