Invention Application
- Patent Title: PAD STRUCTURE AND FABRICATION METHODS
- Patent Title (中): 垫结构和制造方法
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Application No.: PCT/US2017/021119Application Date: 2017-03-07
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Publication No.: WO2017155969A1Publication Date: 2017-09-14
- Inventor: NG, Hou T. , PATIBANDLA, Nag B. , BAJAJ, Rajeev , REDFIELD, Daniel , CHOCKALINGAM, Ashwin , YAMAMURA, Mayu , CORNEJO, Mario
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: 3050 Bowers Avenue Santa Clara, California 95054 US
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: 3050 Bowers Avenue Santa Clara, California 95054 US
- Agency: PATTERSON, B. Todd et al.
- Priority: US62/305,582 20160309
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L21/304 ; H01L21/321 ; H01L21/02
Abstract:
A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.
Information query
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