The invention relates to a method for testing optoelectronic chips (1) that are arranged on a wafer and comprise electric interfaces in the form of contact pads (1.1) and optical interfaces in the form of optical deflection elements (1.2), e.g. grating couplers, which are arranged in a fixed manner relative to the electric interfaces and have a specific coupling angle (a). The wafer is adjusted in three adjustment steps in such a manner that one of the chips (1) is positioned relative to a contacting module (2) such that the electric interfaces of the chip (1) and the contacting module (2) are in contact with one another and the optical interfaces of the chip (1) and the contacting module (2) assume a maximum position of the optical coupling.