Invention Application
- Patent Title: PACKAGE SPARK GAP STRUCTURE
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Application No.: PCT/US2020/052622Application Date: 2020-09-25
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Publication No.: WO2021096597A1Publication Date: 2021-05-20
- Inventor: ALEKSOV, Aleksandar , EID, Feras , SWAN, Johanna M. , ELSHERBINI, Adel A. , STRONG, Veronica Aleman
- Applicant: INTEL CORPORATION
- Applicant Address: 2200 Mission College Boulevard
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: 2200 Mission College Boulevard
- Agency: ZAGER, Laura A.
- Priority: US16/683,125 2019-11-13
- Main IPC: H01L23/60
- IPC: H01L23/60 ; H01L23/13 ; H01L23/528 ; H01L23/498
Abstract:
Embodiments may relate to a microelectronic package with an electrostatic discharge (ESD) protection structure within the package substrate. The ESD protection structure may include a cavity that has a contact of a signal line and a contact of a ground line positioned therein. Other embodiments may be described or claimed.
Information query
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