Provided are an electronic device and a manufacturing method capable of electrically joining, with high position accuracy, an external connection terminal onto a metal wiring pattern formed on a thermoformable base material while reducing the number of components.　The present invention comprises: a base material that is made of a synthetic resin material and is deformable from a substantially flat two-dimensional shape into a substantially three-dimensional shape; an external connection terminal for electrically connecting a metal wiring pattern disposed on the base material to an external element provided outside the base material and contacting the metal wiring pattern in a recessed section that is shaped into a three-dimensional shape in the thickness direction of the base material by thermoforming the base material; a resin layer that covers at least one surface of the base material and forms a housing surrounding the external connection terminal so that a terminal surface, which is a surface of the external connection terminal, is exposed; a joining means for electrically joining the metal wiring pattern and the external connection terminal in the recessed section; and a coating layer that fills a recessed portion and covers the joining means.