- 专利标题： DEMOUNTABLE SOLDER JOINTS FOR COUPLING SUPERCONDUCTING CURRENT PATHS
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申请号： PCT/US2021/024151申请日： 2021-03-25
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公开(公告)号： WO2021257145A2公开(公告)日： 2021-12-23
- 发明人: LABOMBARD, Brian , BECK, William , MOURATIDIS, Theodore
- 申请人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY
- 申请人地址： 77 Massachusetts Avenue
- 专利权人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY
- 当前专利权人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY
- 当前专利权人地址： 77 Massachusetts Avenue
- 代理机构： MILMAN, Seth, A. et al.
- 优先权： US63/000,413 2020-03-26
- 主分类号： H01F6/06
- IPC分类号： H01F6/06 ; G21B1/05 ; G21B1/057 ; H01F6/065
摘要：
Described are concepts directed toward systems, structures and techniques to create low-resistance, high current capacity, demountable solder joint connections. Such systems, structures and techniques may be used to simultaneously create low-resistance, high current capacity, demountable solder joint connections at multiple locations between no insulation (NI) superconductors and in particular between NI high temperature superconductors (HTS) such as may be used in NI-HTS magnets.
