Invention Application
- Patent Title: SUBSTRATE MEASUREMENT SUBSYSTEM
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Application No.: PCT/US2021/042643Application Date: 2021-07-21
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Publication No.: WO2022020521A1Publication Date: 2022-01-27
- Inventor: UMMETHALA, Upendra , ERICKSON, Blake , KUMAR, Prashanth , KUTNEY, Michael , TINDEL, Steven Trey , ZHU, Zhaozhao
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: 3050 Bowers Avenue
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: 3050 Bowers Avenue
- Agency: PORTNOVA, Marina et al.
- Priority: US17/379,677 2021-07-19
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/67 ; H01L21/677 ; G01B11/002 ; G01N21/25 ; G01N21/9505 ; H01L21/67259 ; H01L21/67276 ; H01L21/67294
Abstract:
A method for a substrate measurement subsystem is provided. An indication is received that a substrate being processed at a manufacturing system has been loaded into a substrate measurement subsystem. First positional data of the substrate within the substrate measurement subsystem is determined. One or more portions of the substrate to be measured by one or more sensing components of the substrate measurement subsystem are determined based on the first positional data of the substrate and a process recipe for the substrate. Measurements of each of the determined portions of the substrate are obtained by one or more sensing components of the substrate measurement subsystem. The obtained measurements of each of the determined portions of the substrate are transmitted to a system controller.
Information query
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