公开(公告)号：WO2022268149A1

公开(公告)日：2022-12-29

申请号：PCT/CN2022/100658

申请日：2022-06-23

Applicant: 北京北方华创微电子装备有限公司

Inventor： 朱金恒

IPC: H01L21/67 ,  H01L21/67276

Abstract: 本申请公开一种半导体工艺设备及其运动部件的控制方法和装置，其中控制方法包括：获取当前动作任务，所述当前动作任务包括多个子动作对象；确定当前子动作对象和待执行子动作对象，所述待执行子动作对象被配置为在所述当前子动作对象之后执行；控制与所述当前子动作对象关联的当前运动部件执行所述当前子动作对象；在执行完所述当前子动作对象之后，确定与所述待执行子动作对象关联的待用运动部件；在所述待用运动部件不包括所述当前运动部件时，将所述当前运动部件的运动状态设置为可用。其可以提高运动部件的利用率，缩短相应动作任务的执行时间，从而缩短工艺任务的总执行时间，提高相应机台产能。

公开(公告)号：WO2022060495A8

公开(公告)日：2022-03-24

申请号：PCT/US2021/045731

申请日：2021-08-12

Applicant: APPLIED MATERIALS, INC.

Inventor： UMMETHALA, Upendra ,  KRAUS, Philip ,  BERDING, Keith ,  ERICKSON, Blake ,  TAE, Patrick ,  HOLEYANNAVAR, Devendra Channappa ,  NARA, Shivaraj Manjunath ,  PARAMESHWARAPPA, Anandakumar ,  NAGARAJAN, Sivasankar ,  KUMAR, Dhirendra

IPC: H01L21/67 ,  H04N5/225 ,  H04N5/30 ,  H01L21/67242 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67276 ,  H04N23/555 ,  H04N23/56 ,  H04N23/60 ,  H04N23/90

Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.

公开(公告)号：WO2021262888A1

公开(公告)日：2021-12-30

申请号：PCT/US2021/038753

申请日：2021-06-23

Applicant: APPLIED MATERIALS, INC.

Inventor： WANG, Chongyang

IPC: G06Q10/06 ,  G06Q50/04 ,  G05B19/4183 ,  G05B19/4187 ,  H01L21/67276

Abstract: A method includes identifying a bottleneck operation of a plurality of operations in a sequence recipe. The plurality of operations are associated with transporting and processing a plurality of substrates in a substrate processing system. The method further includes determining, based on the bottleneck operation, a takt time for the plurality of substrates. The takt time is an amount of time between a first substrate entering the substrate processing system and a second substrate entering the substrate processing system. The method further includes determining a plurality of queue times. Each of the plurality of queue times corresponds to a respective operation of the plurality of operations. The method further includes causing, based on the takt time and the plurality of queue times, the plurality of substrates to be processed by the substrate processing system.

公开(公告)号：WO2022020521A1

公开(公告)日：2022-01-27

申请号：PCT/US2021/042643

申请日：2021-07-21

Applicant: APPLIED MATERIALS, INC.

Inventor： UMMETHALA, Upendra ,  ERICKSON, Blake ,  KUMAR, Prashanth ,  KUTNEY, Michael ,  TINDEL, Steven Trey ,  ZHU, Zhaozhao

IPC: H01L21/66 ,  H01L21/67 ,  H01L21/677 ,  G01B11/002 ,  G01N21/25 ,  G01N21/9505 ,  H01L21/67259 ,  H01L21/67276 ,  H01L21/67294

Abstract: A method for a substrate measurement subsystem is provided. An indication is received that a substrate being processed at a manufacturing system has been loaded into a substrate measurement subsystem. First positional data of the substrate within the substrate measurement subsystem is determined. One or more portions of the substrate to be measured by one or more sensing components of the substrate measurement subsystem are determined based on the first positional data of the substrate and a process recipe for the substrate. Measurements of each of the determined portions of the substrate are obtained by one or more sensing components of the substrate measurement subsystem. The obtained measurements of each of the determined portions of the substrate are transmitted to a system controller.

公开(公告)号：WO2021262890A1

公开(公告)日：2021-12-30

申请号：PCT/US2021/038756

申请日：2021-06-23

Applicant: APPLIED MATERIALS, INC.

Inventor： WANG, Chongyang

IPC: G05B19/04 ,  G05B19/418 ,  H01L21/67 ,  G05B19/4187 ,  G05B19/41875 ,  H01L21/67276

Abstract: A method includes receiving a plurality of operations in a sequence recipe. The plurality of operations are associated with processing a plurality of substrates in a substrate processing system. The method further includes identifying a plurality of completion times corresponding to the plurality of operations. Each completion time of the plurality of completion times corresponds to completion of a respective operation of the plurality of operations. The method further includes simulating the plurality of operations by setting a virtual time axis to each of the plurality of completion times to generate a schedule for the sequence recipe. The method further includes causing, based on the schedule, the plurality of substrates to be processed or performance of a corrective action.

公开(公告)号：WO2021262689A1

公开(公告)日：2021-12-30

申请号：PCT/US2021/038437

申请日：2021-06-22

Applicant: LAVORRO, INC.

Inventor： OBERAL, Akshay ,  BHATTACHERJEE, Arya, Priya

IPC: G05B19/418 ,  H01L21/67 ,  G06Q50/04 ,  G06N3/00 ,  G06T19/00 ,  H01L21/67276 ,  H01L21/67736 ,  H01L21/67766

Abstract: In one embodiment, a system includes a wafer-handling system of a semiconductor-manufacturing system. The wafer-handling system is configured to hold one or more wafers for processing. The system also includes one or more processing components configured to physically treat the one or more wafers; a controller configured to operate the processing components; and a text bot in communication with the semiconductor-manufacturing system and configured to respond to a user inquiry.