Invention Application
- Patent Title: ROLLER FOR LOCATION-SPECIFIC WAFER POLISHING
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Application No.: PCT/US2022/018360Application Date: 2022-03-01
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Publication No.: WO2022187259A1Publication Date: 2022-09-09
- Inventor: MIKHAYLICHENKO, Ekaterina A. , REDEKER, Fred C. , BROWN, Brian J. , RODRIGO, Chirantha , ZUNIGA, Steven M. , GURUSAMY, Jay
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: 3050 Bowers Avenue
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: 3050 Bowers Avenue
- Agency: GOREN, David J.
- Priority: US63/157,610 2021-03-05
- Main IPC: B24B37/20
- IPC: B24B37/20 ; B24B57/02 ; B24B41/06 ; B24B49/02 ; H01L21/67
Abstract:
A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.
Information query
