公开(公告)号：WO2022187259A1

公开(公告)日：2022-09-09

申请号：PCT/US2022/018360

申请日：2022-03-01

Applicant: APPLIED MATERIALS, INC.

Inventor： MIKHAYLICHENKO, Ekaterina A. ,  REDEKER, Fred C. ,  BROWN, Brian J. ,  RODRIGO, Chirantha ,  ZUNIGA, Steven M. ,  GURUSAMY, Jay

IPC: B24B37/20 ,  B24B57/02 ,  B24B41/06 ,  B24B49/02 ,  H01L21/67

Abstract: A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.

公开(公告)号：WO2023069160A1

公开(公告)日：2023-04-27

申请号：PCT/US2022/037086

申请日：2022-07-14

Applicant: APPLIED MATERIALS, INC.

Inventor： CHOU, Chih Chung ,  IYER, Anand Nilakantan ,  MIKHAYLICHENKO, Ekaterina A. ,  LEE, Christopher HeungGyun ,  CHANG, Shou-Sung

IPC: B24B57/02 ,  B24B37/10 ,  B06B1/06 ,  H01L21/67

Abstract: Exemplary slurry delivery systems may include a slurry source. The systems may include a slurry line coupled with the slurry source. The systems may include a slurry dispensing nozzle. The nozzle may include a lumen having an inlet that is fluidly coupled with a slurry outlet of the slurry line. The nozzle may include a body defining a reservoir and an exit port. The reservoir may be fluidly coupled with a downstream end of the lumen. The exit port may be coupled with the reservoir. The nozzle may include a valve seat. The nozzle may include a valve member having a first surface positioned against the valve seat when in a closed position. The valve member may be movable to an open position in which the first surface is spaced apart from the valve seat. The nozzle may include an actuator coupled with a second surface of the valve member.

公开(公告)号：WO2022187023A1

公开(公告)日：2022-09-09

申请号：PCT/US2022/017261

申请日：2022-02-22

Applicant: APPLIED MATERIALS, INC.

Inventor： MIKHAYLICHENKO, Ekaterina A. ,  LEE, Christopher Heung-Gyun ,  IYER, Anand N. ,  TRAN, Huyen ,  HIGASHI, Patrick A.

IPC: B24B37/015 ,  B24B57/02 ,  B24B49/04 ,  B24B55/02

Abstract: A method for removing material from a substrate includes dispensing an abrasive slurry on a polishing pad, storing an indication of a relative charge on the abrasive agent, contacting a surface of a substrate to the polishing pad in the presence of the slurry, generating relative motion between the substrate and the polishing pad, measuring a removal rate for the substrate, comparing a the measured removal rate to a target removal rate and determining whether to increase or decrease the removal rate based on the comparison, determining whether to increase or decrease a temperature of an interface between the polishing pad and the substrate based on the indication of the relative charge of the abrasive agent and on whether to increase or decrease the removal rate, and controlling a temperature of the interface as determined to modify the removal rate.

公开(公告)号：WO2022006161A1

公开(公告)日：2022-01-06

申请号：PCT/US2021/039692

申请日：2021-06-29

Applicant: APPLIED MATERIALS, INC.

Inventor： BROWN, Brian J. ,  MIKHAYLICHENKO, Ekaterina A. ,  KIRKPATRICK, Brian K.

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  H01L21/02 ,  B08B1/002 ,  B08B1/04 ,  B08B13/00 ,  B08B2203/007 ,  B08B3/02 ,  B08B3/022 ,  B08B3/041 ,  B08B3/08 ,  B08B3/12 ,  B08B3/14 ,  B08B7/04 ,  B65G47/90 ,  H01L21/02074 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/68707

Abstract: A substrate cleaning system to remove particulates from multiple substrates includes a first container for applying a cleaning liquid to substrates, a second container for applying a rinsing liquid to substrates, and a robot system. The first container includes at least two openable and closable access ports in a top of the first container and a plurality of supports to hold the substrates at respective edges in the first container. The second container has a plurality of supports to hold the substrates at respective edges in the second container. The robot system transports substrates through the at least two openable and closable access ports in the top of the first container, and transports substrates through a top of the second container.