公开(公告)号：WO2023003724A1

公开(公告)日：2023-01-26

申请号：PCT/US2022/036790

申请日：2022-07-12

Applicant: APPLIED MATERIALS, INC.

Inventor： SONG, Kevin H. ,  PANG, Benedict W.

IPC: B24B57/02 ,  B24B41/06 ,  B24B37/20

Abstract: Exemplary substrate edge polishing apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include an edge ring seated on the chuck body. The apparatuses may include a retaining wall disposed radially outward of the edge ring. The apparatuses may include a slurry delivery port disposed radially inward of the retaining wall. The apparatuses may include a cylindrical spindle that is positionable over the chuck body. The apparatuses may include an annular polishing pad coupled with a lower end of the cylindrical spindle.

公开(公告)号：WO2022210165A1

公开(公告)日：2022-10-06

申请号：PCT/JP2022/013510

申请日：2022-03-23

Applicant: 富士紡ホールディングス株式会社

Inventor： 立野　哲平 ,  栗原　浩 ,  山口　さつき ,  ▲高▼見沢　大和

IPC: B24B37/20 ,  B24B37/24 ,  C08J5/14 ,  H01L21/304

Abstract: 被研磨物を研磨加工するための研磨面を有する研磨層を備える研磨パッドであって、前記研磨層は、前記研磨層内に中空体を形成する中空微小球体を含み、前記研磨層の断面は、１０～１４μｍの平均開孔径を有し、１μｍの範囲を１階級として表される、前記研磨層の断面の開孔径ヒストグラムにおいて、２５μｍ以上の開孔数の総和は、前記断面の全開孔数に対して５％以下であり、２５μｍ以上の各階級の開孔面積の総和は、前記断面の合計開孔面積に対して、２０％以下である、研磨パッド。

公开(公告)号：WO2022177726A1

公开(公告)日：2022-08-25

申请号：PCT/US2022/014538

申请日：2022-01-31

Applicant: APPLIED MATERIALS, INC.

Inventor： ZUNIGA, Steven M. ,  NAGENGAST, Andrew

IPC: B24B37/32 ,  B24B37/20 ,  H01L21/67

Abstract: A substrate carrier configured to be attached to a polishing system for polishing a substrate is described herein. The substrate carrier includes a housing including a plurality of load couplings and a retaining ring coupled to the housing. The retaining ring can include an annular body having a central axis, an inner edge facing the central axis of the annular body, the inner edge having a diameter configured to surround a substrate, and an outer edge opposite the inner edge, wherein the plurality of load couplings contact the retaining ring at different radial distances measured from the central axis, and wherein the plurality of load couplings are configured to apply a radially differential force to the retaining ring.

公开(公告)号：WO2021257254A1

公开(公告)日：2021-12-23

申请号：PCT/US2021/034010

申请日：2021-05-25

Applicant: GLOBALWAFERS CO., LTD.

Inventor： IKEDA, Masaaki

IPC: H01L21/02 ,  H01L21/306 ,  B24B37/015 ,  B24B37/20 ,  B24B49/14 ,  H01L21/02024 ,  H01L21/304 ,  H01L21/30625

Abstract: A method of preheating a polishing pad of a semiconductor wafer polishing system includes heating a fluid to a first predetermined temperature. The method also includes applying the fluid to the polishing pad. The method further includes rotating the polishing pad such that the fluid covers the polishing pad. The fluid increases a polishing pad temperature to a second predetermined temperature.

公开(公告)号：WO2020243196A1

公开(公告)日：2020-12-03

申请号：PCT/US2020/034740

申请日：2020-05-27

Applicant: APPLIED MATERIALS, INC.

Inventor： KIM, Bum Jick ,  LOI, Danielle ,  GURUSAMY, Jay ,  ZUNIGA, Steven M.

IPC: B24B37/04 ,  B24B37/20 ,  B24B37/013 ,  H01L21/67

Abstract: Embodiments of the present disclosure generally relate to methods of manufacturing polishing platens for use on a chemical mechanical polishing (CMP) system and polishing platens formed therefrom. A method of manufacturing a polishing includes positioning a polishing platen on a support of a manufacturing system. The manufacturing system includes the support and a cutting tool facing there towards. Here, the polishing platen includes a cylindrical metal body having a polymer layer disposed on a surface thereof and the polymer layer has a thickness of about 100 μm or more. The method further includes removing at least a portion of the polymer layer using the cutting tool to form a polishing pad-mounting surface. Beneficially, the method may be used to form a pad-mounting surface having a desired flatness or shape, such as a concave or convex shape.

公开(公告)号：WO2019199073A1

公开(公告)日：2019-10-17

申请号：PCT/KR2019/004350

申请日：2019-04-11

Applicant: 삼성전자 주식회사

Inventor： 홍상곤 ,  송승원 ,  박석효 ,  김성준

IPC: C09G1/04 ,  C09G1/02 ,  C09K3/14 ,  B24B37/04 ,  B24B37/20 ,  B24B57/02 ,  H01L21/304 ,  H01L21/306

Abstract: 본 개시의 다양한 실시예에 따른 연마 조성물은 함불소 화합물, PH 조절제, 첨가제 및 물을 포함하며, 상기 함불소 화합물은 상기 연마 조성물의 총 중량 대비 0.01 ~ 20 중량 % 및 상기 PH 조절제는 상기 연마 조성물의 총 중량 대비 0.01 ~ 40 중량 % 일 수 있다.

公开(公告)号：WO2016120516A1

公开(公告)日：2016-08-04

申请号：PCT/FI2015/050056

申请日：2015-01-28

Applicant: KWH MIRKA LTD

Inventor： HEDE, Hans ,  HÖGLUND, Göran

IPC: B24B37/20 ,  B24B41/00 ,  B24B29/00 ,  B24B21/00

CPC classification number: B24B37/24 ,  B24B29/00

Abstract: The invention relates to a polishing pad for polishing a surface, material for a polishing pad and a method for manufacturing material for a polishing pad. A polishing pad according to an embodiment comprises a backing layer and a polishing layer made of sheep wool fibres fixed onto a surface of the backing layer, wherein the polishing layer comprises loops made of sheep wool fibres.

Abstract translation: 本发明涉及用于抛光表面的抛光垫，用于抛光垫的材料和用于制造抛光垫材料的方法。 根据实施例的抛光垫包括背衬层和由固定在背衬层的表面上的羊毛纤维制成的抛光层，其中抛光层包括由羊毛纤维制成的环。

公开(公告)号：WO2015065793A1

公开(公告)日：2015-05-07

申请号：PCT/US2014/061838

申请日：2014-10-22

Applicant: APPLIED MATERIALS, INC.

Inventor： KRISHNAN, Kasiraman ,  PATIBANDLA, Nag, B. ,  GOPALAN, Periya

IPC: H01L21/304 ,  B24B37/20

CPC classification number: B24D18/0054 ,  B24B37/245 ,  B24D3/28 ,  B29C64/112 ,  B29C64/165 ,  B29C64/386 ,  B29K2101/10 ,  B29K2101/12 ,  B29K2105/0067 ,  B29K2105/16 ,  B29L2031/736 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00

Abstract: A method of fabricating a polishing layer of a polishing pad includes determining a desired distribution of particles to be embedded within a polymer matrix of the polishing layer. A plurality of layers of the polymer matrix is successively deposited with a 3D printer, each layer of the plurality of layers of polymer matrix being deposited by ejecting a polymer matrix precursor from a nozzle. A plurality of layers of the particles is successively deposited according to the desired distribution with the 3D printer. The polymer matrix precursor is solidified into a polymer matrix having the particles embedded in the desired distribution.

Abstract translation: 制造抛光垫的抛光层的方法包括确定嵌入抛光层的聚合物基质内的颗粒的期望分布。 聚合物基体的多个层被连续地沉积有3D打印机，通过从喷嘴喷射聚合物基质前体而将多层聚合物基质的各层沉积。 根据3D打印机的期望分布，依次沉积多层颗粒。 将聚合物基质前体固化成具有嵌入所需分布的颗粒的聚合物基质。

公开(公告)号：WO2014116491A1

公开(公告)日：2014-07-31

申请号：PCT/US2014/011792

申请日：2014-01-16

Applicant: NEXPLANAR CORPORATION

Inventor： LEFEVRE, Paul Andre ,  ALLISON, William C. ,  SIMPSON, Alexander William ,  SCOTT, Diane ,  HUANG, Ping ,  CHARNS, Leslie M. ,  RINEHART, James Richard ,  KERPRICH, Robert

IPC: B24B37/26 ,  B24B37/20 ,  B24B37/22

CPC classification number: B24B37/26 ,  B24B37/205 ,  B24B37/22

Abstract: A polishing pad (200, 800, 1000) for polishing a substrate, the polishing pad comprising: a polishing body (200A, 1112) having a polishing side (201A) opposite a back surface (201B, 1116) and a polishing surface (200B, 1002, 1114) comprising a plurality of protrusions (202, 802, 1008, 1120) continuous with the polishing side (201A) of the polishing body (200A, 1112).

Abstract translation: 1.一种用于抛光基板的抛光垫（200,800,1000），所述抛光垫包括：抛光体（200A，1112），其具有与背面（201B，1116）相对的抛光侧（201A）和抛光面（200B ，1002,1114），其包括与抛光体（200A，1112）的抛光侧（201A）连续的多个突起（202,802,1008,1120）。

公开(公告)号：WO2013099083A1

公开(公告)日：2013-07-04

申请号：PCT/JP2012/007072

申请日：2012-11-05

Applicant: コニカミノルタ株式会社

Inventor： 河合　秀樹 ,  小松　隆史

IPC: G11B5/84 ,  B24B37/00 ,  B24B37/08 ,  B24B37/20

CPC classification number: G11B5/8404

Abstract: 　本発明のＨＤＤ用ガラス基板の製造方法は、両面研磨機を用いる工程を有し、該工程は、研磨後のガラス基板等に残存する研磨剤スラリーを洗浄する工程と、研磨パッドにコロイダルシリカを含む研磨剤スラリーを添加して潤滑層を形成する工程とを有し、前記コロイダルシリカの平均一次粒子径が１５～９０ｎｍであり、前記潤滑層における前記コロイダルシリカの面密度が１０～５００個／μｍ ２ であることを特徴とする。当該製造方法によれば、優れた平坦度を有し、微小うねりの少ないガラス基板が得られ得る。

Abstract translation: 该制造HDD用玻璃基板的方法的特征在于，该方法具有使用双面研磨机的工序， 该步骤具有清洗抛光后残留在玻璃基板等上的抛光剂浆料的步骤，以及通过向研磨垫中添加含有胶体二氧化硅的研磨剂浆液形成润滑层的步骤; 胶体二氧化硅的平均一次粒径为15〜90nm; 并且润滑层中的胶体二氧化硅的表面密度为10-500个/ m 2。 在该制造方法中，可以获得具有优异的平面度和较小翘曲的玻璃基板。