The disclosure relates to a power semiconductor module (1) comprising at least two groups (2, 3; 31, 32, 33, 34) of semiconductor switches (4) connected in parallel, the semiconductor switches (4) of each group being connected in parallel within the group (2, 3; 31, 32, 33, 34), a module gate contact (5), a group gate contact (6,7) for each group, a first branching point (8) connected to the module gate contact (5) and to the group gate contacts (6, 7), a gate path between the module gate contact (5) and the first branching point (8) being shared for the at least two groups of semiconductor switches (2, 3; 31, 32, 33, 34), and a compensation structure (9; 39) in a connection path between the first branching point (8) and gate terminals (10) of the semiconductor switches (4) of at least one group (3) of semiconductor switches (4) for increasing the inductance of said connection path.