公开(公告)号：EP4205180A2

公开(公告)日：2023-07-05

申请号：EP21835884.4

申请日：2021-05-13

申请人： Microsoft Technology Licensing, LLC

发明人： BONDERSON, Parsa ,  NAYAK, Chetan ,  REILLY, David ,  YOUNG, Andrea Franchini ,  ZALETEL, Michael

IPC分类号： H01L29/66 ,  H01L29/76 ,  G06N10/40 ,  H01L29/06 ,  H01L29/16 ,  H01L29/26 ,  H01L29/423 ,  B82Y10/00 ,  H01L29/20 ,  H01L29/22

公开(公告)号：EP4189611A2

公开(公告)日：2023-06-07

申请号：EP21836257.2

申请日：2021-05-13

申请人： Microsoft Technology Licensing, LLC

发明人： KARZIG, Torsten ,  LUTCHYN, Roman Mykolayovych ,  VAYRYNEN, Jukka Ilmari ,  BAUER, Roman Bela

IPC分类号： G06N10/40 ,  G06N10/20

公开(公告)号：EP4158680A1

公开(公告)日：2023-04-05

申请号：EP21713854.4

申请日：2021-03-02

申请人： Microsoft Technology Licensing, LLC

发明人： GARDNER, Geoffrey C. ,  GRONIN, Sergei V. ,  KALLAHER, Raymond L. ,  MANFRA, Michael James

IPC分类号： H01L21/20 ,  H01L39/24

公开(公告)号：EP4111508A1

公开(公告)日：2023-01-04

申请号：EP20708078.9

申请日：2020-02-28

申请人： Microsoft Technology Licensing, LLC

发明人： MAZUR, Grzegorz, Piotr ,  VAN LOO, Nick ,  QUINTERO PÉREZ, Marina

IPC分类号： H01L39/12 ,  G06N10/00 ,  H01L39/22 ,  H01L39/24

公开(公告)号：EP4072264A2

公开(公告)日：2022-10-19

申请号：EP20898940.0

申请日：2020-12-10

申请人： Agnetix, Inc.

发明人： LYS, Ihor ,  MADERAS, Nicholas

IPC分类号： A01G7/04 ,  A01G9/24 ,  F21Y115/10

公开(公告)号：EP4070391A1

公开(公告)日：2022-10-12

申请号：EP20830437.8

申请日：2020-12-04

申请人： Microsoft Technology Licensing, LLC

发明人： GARDNER, Geoffrey Charles ,  DRACHMANN, Asbjørn Cennet Cliff ,  MARCUS, Charles Masamed ,  MANFRA, Michael James

IPC分类号： H01L39/24 ,  H01L39/22

公开(公告)号：EP4207996A1

公开(公告)日：2023-07-05

申请号：EP23151185.8

申请日：2021-03-25

申请人： Microsoft Technology Licensing LLC

发明人： CANTALOUBE, Christopher A.

IPC分类号： H10N69/00 ,  H01L23/485

摘要： Described is a method of forming an integrated circuit (50) that comprises a plurality of conductive contact pads (60) on a surface of a first substrate (52), and a dielectric layer (54) overlying the first substrate and the conductive contact pads, which may be coupled to respective qubits (62). A second substrate (56) overlies the dielectric layer, and a plurality of superconducting contacts (58) extend through the second substrate and the dielectric layer such that each superconducting contact is aligned with and in contact with a respective conductive contact pad and may be coupled to a respective resonator (64).

公开(公告)号：EP4143883A1

公开(公告)日：2023-03-08

申请号：EP21720330.6

申请日：2021-03-25

申请人： Microsoft Technology Licensing, LLC

发明人： CANTALOUBE, Christopher A

IPC分类号： H01L27/18 ,  H01L25/065 ,  H01L23/485 ,  H01L21/60

公开(公告)号：EP4143591A1

公开(公告)日：2023-03-08

申请号：EP20723348.7

申请日：2020-04-29

申请人： Microsoft Technology Licensing, LLC

发明人： MALINOWSKI, Filip, Kazimierz, ,  KOSKI, Jonne, Verneri,

IPC分类号： G01R31/26 ,  G01R27/26

公开(公告)号：EP4134336A1

公开(公告)日：2023-02-15

申请号：EP22198707.6

申请日：2019-08-02

申请人： Beijing Jingdong Qianshi Technology Co., Ltd.

发明人： CHEN, Ying ,  XIAO, Jun ,  ZHANG, Yafang ,  WANG, Zhao ,  ZHANG, Jian ,  ZHANG, Qiang

IPC分类号： B65G1/04 ,  B65G1/137 ,  G06Q10/08

摘要： A distribution site and a distribution method are provided. The distribution site includes: a building (1) having a storage space (9) configured to store goods, a distribution interface area configured to park an unmanned ground distribution vehicle (2) that is capable of performing goods distribution, a goods sorting device (8) arranged in the building (1) and configured to load the goods in the storage space (9) onto the unmanned ground distribution vehicle (2) and a goods replenishing device comprising a rotary container (5) for receiving goods. The rotary container (5) is replenished with goods from the outside, after opening a replenishing door (15). The distribution site and the distribution method can reduce dependence on labor.