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1.发明公开Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate 有权用于增加强度的方法和装置elektrolytishen的电介质基板上的导电图案
公开(公告)号：EP1562412A3
公开(公告)日：2005-11-30
申请号：EP05075239.3
申请日：2005-01-31
申请人： Besi Plating B.V.
CPC分类号： C25D5/022 , C25D5/04 , H05K1/0393 , H05K3/241 , H05K2203/1453 , H05K2203/1545
摘要： The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of
immersing the substrate with the pattern present thereon in an electrolytic bath,
electrically contacting in the electrolytic bath a negatively charged electrode with the pattern during immersion of the substrate, and
effecting contacting movement in the electrolytic bath of the electrode and the pattern with respect to each other during immersion of the substrate.
The invention furthermore provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.摘要翻译： 本发明提供一种方法，用于与图案电解增加在电介质基片的导电图案的厚度，包括浸渍有图案的衬底的步骤在电解浴在其上呈现，电接触在电解浴中的带负电荷的电极 基板的浸泡期间，及影响在电极的电解浴，将基板浸入期间相对于所述图案彼此接触运动。 本发明进一步提供更多用于电解增加导电图案的厚度上的介电基片的装置。
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2.发明公开
公开(公告)号：EP1562412A2
公开(公告)日：2005-08-10
申请号：EP05075239.3
申请日：2005-01-31
申请人： Besi Plating B.V.
CPC分类号： C25D5/022 , C25D5/04 , H05K1/0393 , H05K3/241 , H05K2203/1453 , H05K2203/1545
摘要： The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of
immersing the substrate with the pattern present thereon in an electrolytic bath,
electrically contacting in the electrolytic bath a negatively charged electrode with the pattern during immersion of the substrate, and
effecting contacting movement in the electrolytic bath of the electrode and the pattern with respect to each other during immersion of the substrate.
The invention furthermore provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.摘要翻译： 本发明提供一种方法，用于与图案电解增加在电介质基片的导电图案的厚度，包括浸渍有图案的衬底的步骤在电解浴在其上呈现，电接触在电解浴中的带负电荷的电极 基板的浸泡期间，及影响在电极的电解浴，将基板浸入期间相对于所述图案彼此接触运动。 本发明进一步提供更多用于电解增加导电图案的厚度上的介电基片的装置。
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