APPARATUS FOR USE IN AN ELECTROETCHING OR ELECTRODEPOSITION PROCESS AND AN ELECTROETCHING OR ELECTRODEPOSITION PROCESS
    1.
    发明公开
    APPARATUS FOR USE IN AN ELECTROETCHING OR ELECTRODEPOSITION PROCESS AND AN ELECTROETCHING OR ELECTRODEPOSITION PROCESS 审中-公开
    VERRICHTUNG ZUR VERWENDUNG在ELEKTROÄTZ-ODER ELEKTROABSCHEIDUNGSVERFAHREN UNDELEKTROÄTZ-ODER ELEKTROABSCHEIDUNGSVERFAHREN

    公开(公告)号:EP3064618A1

    公开(公告)日:2016-09-07

    申请号:EP16154750.0

    申请日:2016-02-09

    申请人: Rolls-Royce plc

    摘要: There is disclosed an apparatus for use in an electroetching or electrodeposition process in which material is etched from or deposited onto the surface of an electrically conductive component. The apparatus comprises a support for supporting the component within a tank containing an electrolytic solution; and a first-polarity electrode arranged to be located within the tank and immersed in the electrolytic solution and shaped to surround at least a part of the component in a contactless manner. In use, an electric field produced by the first-polarity electrode results in an electric variance between at least a part of the component and a second-polarity electrode having a polarity opposite to that of the first-polarity electrode. An electroetching and an electrodeposition process are also disclosed.

    摘要翻译: 公开了一种用于电蚀或电沉积工艺的装置,其中材料从导电部件的表面上蚀刻或沉积到导电部件的表面上。 该装置包括用于将部件支撑在包含电解液的罐内的支撑件; 以及第一极性电极,其布置成位于所述罐内并浸没在所述电解液中并成形为以非接触方式围绕所述部件的至少一部分。 在使用中,由第一极性电极产生的电场导致部件的至少一部分与具有与第一极性电极极性相反的极性的第二极性电极之间的电差异。 还公开了一种电蚀和电沉积方法。

    Verfahren zur elektrolytischen Beschichtung komplexer Bauteile
    2.
    发明公开
    Verfahren zur elektrolytischen Beschichtung komplexer Bauteile 审中-公开
    一种用于复合组件的电解涂覆过程

    公开(公告)号:EP3064615A1

    公开(公告)日:2016-09-07

    申请号:EP15157447.2

    申请日:2015-03-03

    发明人: Wilbuer, Klaus

    摘要: Die Erfindung betrifft ein Verfahren zur galvanischen Beschichtung komplexer Bauteile, wobei das Bauteil im Rahmen einer Elektrolyse mittels eines Elektrolyten mit wenigstens einer Schicht eines Metalls oder einer Legierung beschichtet wird, dadurch gekennzeichnet, dass während der Elektrolyse wenigstens zeitweise eine Relativbewegung zwischen dem zu beschichtenden Bauteil und dem Elektrolyten erzeugt wird.

    摘要翻译: 本发明涉及一种用于复合组件的电解涂层,其中所述组分包衣如使用在电解过程中具有金属或合金,其特征在于,至少一个层,至少是暂时的电解质的电解的一部分的方法,待涂覆的部件之间的相对运动和 电解质被产生。

    AGITATOR AND METHOD OF COATING A COMPONENT
    3.
    发明公开
    AGITATOR AND METHOD OF COATING A COMPONENT 审中-公开
    RÜHRERUND VERFAHREN ZUR BESCHICHTUNG VON BAUTEILEN

    公开(公告)号:EP2995371A1

    公开(公告)日:2016-03-16

    申请号:EP15180764.1

    申请日:2015-08-12

    申请人: Rolls-Royce plc

    IPC分类号: B01F11/00 C25D15/00 C25D21/10

    摘要: The present invention provides an agitator (1) for agitating a liquid (10, e.g. an electrolyte solution) containing particles (e.g. abrasive particles) within a tank (9). The agitator comprises an agitator body having an upper surface (3) and a lower surface (4) with at least one aperture (5, 5') extending through the agitator body. There is a one-way valve (7, 7') for allowing liquid flow through at least one aperture from the upper surface to the lower surface and for blocking liquid flow through at least one aperture from the lower surface to the upper surface.

    摘要翻译: 本发明提供一种用于搅拌在罐(9)内含有颗粒(例如磨料颗粒)的液体(例如电解液)的搅拌器(1)。 搅拌器包括具有上表面(3)和下表面(4)的搅拌器主体,其具有延伸穿过搅拌器主体的至少一个孔(5,5')。 存在用于允许液体从上表面到下表面流过至少一个孔的单向阀(7,7'),并且阻止液体从下表面到上表面的至少一个孔流动。

    A CONDUCTOR OF PLUG, SOCKET OR CONNECTOR THAT IS IMPROVED BY CONDUCTING MATERIAL
    8.
    发明公开
    A CONDUCTOR OF PLUG, SOCKET OR CONNECTOR THAT IS IMPROVED BY CONDUCTING MATERIAL 审中-公开
    塞,架或连接器头通过对导电材料比较好

    公开(公告)号:EP2224542A1

    公开(公告)日:2010-09-01

    申请号:EP08733848.9

    申请日:2008-03-27

    申请人: Li, Shihuang

    发明人: Li, Shihuang

    摘要: A conductor (2) of a plug, socket or connector is provided. The substrate of the conductor (2) is steel and the conductor is obtained by plating a coating of Ni on the substrate, and then plating Cu on the outer surface of the substrate by electrolyzing or electrodepositing, using the substrate as the cathode. Alternatively, the substrate of the conductor (2) is stainless steel, and the conductor (2) is obtained by cladding Cu directly on the columnar stainless steel substrate.

    摘要翻译: 一插头,插座或连接器的导体(2)提供。 所述导体(2)的基板为钢和导体通过电镀在基底上的Ni涂层,然后通过电解或电沉积,使用的基材作为阴极的基片的外表面上镀覆的Cu得到。 可替代地,所述导体(2)的基板是不锈钢,和导体(2)是通过包层铜直接在柱状不锈钢衬底得到。

    Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate
    9.
    发明公开
    Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate 有权
    用于增加强度的方法和装置elektrolytishen的电介质基板上的导电图案

    公开(公告)号:EP1562412A3

    公开(公告)日:2005-11-30

    申请号:EP05075239.3

    申请日:2005-01-31

    申请人: Besi Plating B.V.

    IPC分类号: H05K3/24 C25D7/06

    摘要: The invention provides a method for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, comprising the steps of

    immersing the substrate with the pattern present thereon in an electrolytic bath,
    electrically contacting in the electrolytic bath a negatively charged electrode with the pattern during immersion of the substrate, and
    effecting contacting movement in the electrolytic bath of the electrode and the pattern with respect to each other during immersion of the substrate.

    The invention furthermore provides a device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate.

    摘要翻译: 本发明提供一种方法,用于与图案电解增加在电介质基片的导电图案的厚度,包括浸渍有图案的衬底的步骤在电解浴在其上呈现,电接触在电解浴中的带负电荷的电极 基板的浸泡期间,及影响在电极的电解浴,将基板浸入期间相对于所述图案彼此接触运动。 本发明进一步提供更多用于电解增加导电图案的厚度上的介电基片的装置。

    Verfahren zum galvanischem Metallisieren eines Substrats
    10.
    发明公开
    Verfahren zum galvanischem Metallisieren eines Substrats 失效
    埃菲尔罕锌电镀Metallisieren eines Substrats。

    公开(公告)号:EP0352721A2

    公开(公告)日:1990-01-31

    申请号:EP89113671.5

    申请日:1989-07-25

    摘要: Bei konventionellen Galvanisierverfahren wird das Substrat, z.B. eine mit einem halbleitenden Material beschichtete Glasplatte (1), in einem bewegten Metallsalzbad (2) metallisiert, z.B. vernickelt, wobei die Glasplatte als Kathode und eine Metallelektrode (3) als Anode geschaltet ist. Die Glasplatte wird langsam an der Metallanode vorbeigezogen
    Das Problem liegt darin, schwierig zu galvanisierende Substratmaterialien, wie z.B. ITO (Indium-Tin Oxide), mit einer genügend haftfesten Metallschicht (z.B. Nickel) zu versehen.
    Diese Problem wird dadurch gelöst, daß in das für die Metallisierung verwendete, Tenside enthaltende Nickelbad (5) von unten soviel Luft eingeblasen wird, daß sich an der Badoberfläche eine beständige Schaumschicht (8) bildet. In diese Schaumschicht taucht die Nickelanode (6) ein, an der die zu vernickelnde ITO-Glasplatte (1) langsam vorbeigezogen wird.
    Damit wird eine sehr haftfeste Nickelschicht gleichmäßiger Dicke erreicht.

    摘要翻译: 在传统的电镀工艺中,衬底例如涂有半导体材料的玻璃板在搅拌的金属盐浴中被金属化,例如镀镍,玻璃板作为阴极连接,金属电极作为阳极连接。 玻璃板缓慢拉过金属阳极。 问题在于提供难以电镀的衬底材料,例如具有足够粘合的金属层(例如镍)的ITO(氧化铟锡)。 解决了这个问题,因为足够的空气从下面注入用于金属化的镍浴中,并且含有用于在浴表面形成的稳定泡沫层的表面活性剂。 将要镀镍的ITO-玻璃板缓慢拉过的镍阳极浸入该泡沫层中。 从而实现均匀厚度的非常粘合的镍层。