公开(公告)号：EP4435152A2

公开(公告)日：2024-09-25

申请号：EP24191899.4

申请日：2017-10-25

Applicant: Adeia Semiconductor Technologies LLC

Inventor： UZOH, Cyprian, Emeka

IPC: C25D7/12

CPC classification number: H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/1308420130101 ,  H01L2224/1626520130101 ,  H01L2224/1385520130101 ,  H01L2224/1162220130101 ,  H01L2224/1626820130101 ,  H01L2224/1605920130101 ,  H01L24/80 ,  H01L2224/040120130101 ,  H01L2224/055720130101 ,  H01L2224/0560920130101 ,  H01L2224/0561120130101 ,  H01L2224/0561620130101 ,  H01L2224/0562420130101 ,  H01L2224/0563920130101 ,  H01L2224/0564420130101 ,  H01L2224/0564720130101 ,  H01L2224/0565520130101 ,  H01L2224/0568420130101 ,  H01L2224/1146220130101 ,  H01L2224/1146420130101 ,  H01L2224/114720130101 ,  H01L2224/1300720130101 ,  H01L2224/1301920130101 ,  H01L2224/1310520130101 ,  H01L2224/1310920130101 ,  H01L2224/1311120130101 ,  H01L2224/1311620130101 ,  H01L2224/1312420130101 ,  H01L2224/1313920130101 ,  H01L2224/1314420130101 ,  H01L2224/1314720130101 ,  H01L2224/1315520130101 ,  H01L2224/1318420130101 ,  H01L2224/1356220130101 ,  H01L2224/1356420130101 ,  H01L2224/1365520130101 ,  H01L2224/1368420130101 ,  H01L2224/1380920130101 ,  H01L2224/1381120130101 ,  H01L2224/1384720130101 ,  H01L2224/1605820130101 ,  H01L2224/1614820130101 ,  H01L2224/291920130101 ,  H01L2224/8089520130101 ,  H01L2224/8089620130101 ,  H01L2224/8106520130101 ,  H01L2224/8107520130101 ,  H01L2224/8109120130101 ,  H01L2224/8119320130101 ,  H01L2224/8120320130101 ,  H01L2224/818120130101 ,  H01L2224/818420130101 ,  H01L2225/105820130101 ,  H01L2924/1531120130101 ,  H01L2224/810920130101 ,  H01L2224/0556820130101 ,  H01L2224/0391220130101 ,  H01L2224/8109920130101 ,  H01L2224/1100920130101 ,  H01L2225/0651320130101 ,  H01L2224/1650320130101 ,  H01L2224/0300920130101 ,  H01L2224/1380520130101 ,  H01L2224/8108520130101 ,  H01L2224/8035720130101 ,  H01L2224/055820130101 ,  H01L2224/0556220130101 ,  H01L2224/0556420130101 ,  H01L2224/0557120130101 ,  H01L2224/0557220130101 ,  H01L23/552 ,  H01L2224/8385620130101 ,  H01L2224/8386220130101 ,  H01L2224/9212520130101 ,  H01L2224/808120130101 ,  H01L2224/8098620130101 ,  H01L2224/1623720130101 ,  H01L2224/1614720130101 ,  H01L2224/0823720130101 ,  H01L2224/0514720130101 ,  H01L2224/0558220130101 ,  H01L2224/0558320130101 ,  H01L2224/0584720130101 ,  H01L2224/0584420130101 ,  H01L2224/0585520130101 ,  H01L2224/7310420130101 ,  H01L2224/7320420130101 ,  H05K3/4007 ,  H05K3/3436 ,  H05K2201/1024220130101 ,  H01L2224/803420130101 ,  H01L2224/8014120130101 ,  H01L2224/0814520130101 ,  C25D7/123 ,  C25D5/022 ,  C23C18/1653 ,  C25D5/48 ,  C25D5/10 ,  C25D5/18 ,  C25D3/38 ,  C25D5/605 ,  C25D5/12 ,  C23C18/1658

Abstract: A bonded structure, comprising a first component including a first substrate having a first dielectric surface and a first conductive feature at the first dielectric surface; and a second component including a second substrate having a second dielectric surface and a second conductive feature at the second dielectric surface. The first dielectric surface is directly bonded to the second dielectric surface without an underfill. The first conductive feature is bonded to second conductive feature by way of a conductive bond region between the first and second conductive features, wherein the bond region comprises structural evidence of conductive nanoparticles employed in bonding the first conductive feature to the second conductive feature.

公开(公告)号：EP4423321A1

公开(公告)日：2024-09-04

申请号：EP22813171.0

申请日：2022-10-28

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： TRISCHLER, Heinrich ,  PREINER, Erich ,  SCALBERT, Marie

IPC: C25D1/00 ,  C23F1/00 ,  C25D5/02 ,  C25D5/00 ,  B41K1/00 ,  B31F1/07 ,  C25D7/12 ,  C23F1/02

CPC classification number: C25D5/022 ,  C25D5/605 ,  C25D1/003 ,  C25D7/123 ,  C23F1/02

公开(公告)号：EP4385061A1

公开(公告)日：2024-06-19

申请号：EP23816823.1

申请日：2023-06-02

Applicant: Atlas Magnetics Company

Inventor： MCDONALD, John, Othniel

IPC: H01L21/02 ,  C22C38/08 ,  C22C38/10 ,  C25D3/56 ,  H01L23/29

CPC classification number: C22C38/08 ,  H01L23/49822 ,  C22C38/105 ,  H05K1/165 ,  C25D3/562 ,  C25D5/022 ,  C25D5/12 ,  C25D5/56 ,  C25D7/00

公开(公告)号：EP2457725B1

公开(公告)日：2018-11-28

申请号：EP10802160.1

申请日：2010-06-25

Applicant: Mitsubishi Gas Chemical Company, Inc. ,  PI R & D Co. Ltd

Inventor： NOZAKI, Mitsuru ,  NOMOTO, Akihiro ,  AKIYAMA, Norikatsu ,  NAGATA, Eiji ,  YANO, Masashi

IPC: B32B15/088 ,  C25D7/00 ,  C25D7/06 ,  H05K1/03 ,  H05K3/38 ,  C25D5/02 ,  C25D1/04 ,  B32B15/08

CPC classification number: H05K1/09 ,  B32B15/08 ,  C25D1/04 ,  C25D5/022 ,  C25D7/0614 ,  C25D7/0678 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/384 ,  H05K3/4652 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0307 ,  Y10T428/31681

Abstract: The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method. The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 µm to 3.0 µm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.

公开(公告)号：EP3263745B1

公开(公告)日：2018-10-31

申请号：EP17176748.6

申请日：2017-06-19

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： POKHREL, Ravi ,  THORSETH, Matthew ,  BYRNES, James ,  SCALISI, Mark ,  NIAZIMBETOVA, Zuhra ,  DZIEWISZEK, Joanna

IPC: C25D3/38 ,  C25D5/02 ,  C25D7/00 ,  C25D7/12

CPC classification number: C25D3/38 ,  C25D3/52 ,  C25D5/022 ,  C25D5/22 ,  C25D7/00 ,  C25D7/123 ,  H05K3/205

Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

公开(公告)号：EP3219831A4

公开(公告)日：2018-07-25

申请号：EP14906132

申请日：2014-11-14

Applicant: YKK CORP

Inventor： HASEGAWA KENJI

IPC: C25D5/00 ,  B24B1/00 ,  B24B31/112 ,  B24B31/14 ,  C25D5/02 ,  C25D5/18 ,  C25D5/22 ,  C25D7/00 ,  C25D7/02 ,  C25D17/00 ,  C25D17/12 ,  C25D17/22 ,  C25D21/10 ,  C25F3/02 ,  C25F3/20 ,  C25F3/24 ,  C25F7/00

CPC classification number: C25D5/022 ,  B24B1/002 ,  B24B1/005 ,  B24B31/112 ,  B24B31/14 ,  C25D5/00 ,  C25D5/026 ,  C25D5/18 ,  C25D5/22 ,  C25D7/00 ,  C25D7/02 ,  C25D17/00 ,  C25D17/12 ,  C25D17/22 ,  C25D21/10 ,  C25F3/02 ,  C25F3/20 ,  C25F3/24 ,  C25F7/00

Abstract: There is provided a method for subjecting garment accessories to a surface electrolytic treatment, which can advantageously provide various metallic colors to metallic garment accessories in a cost effective manner. The method can provide a first metallic color on one side of outer surface of the garment accessory while at the same time providing a second metallic color on the other side of the outer surface, by placing one or more metallic garment accessories in an electrolytic solution in a non-contact state with an anode and a cathode for passing electric current through the electrolytic solution, passing electric current through the electrolytic solution and generating a bipolar phenomenon on the garment accessory. The method may further comprise the step of controlling the posture of the garment accessory such that the one side of the outer surface of the garment accessory faces the anode and the other side faces the cathode during passing electric current through the electrolytic solution. The method may further comprise the step of polishing at least a part of the outer surface of the garment accessory during passing electric current through the electrolytic solution.

公开(公告)号：EP3194163A4

公开(公告)日：2018-06-27

申请号：EP15842607

申请日：2015-09-18

Applicant: MODUMETAL INC

Inventor： WHITAKER JOHN D ,  CALDWELL RICHARD J ,  JENNINGS CHAD

IPC: B32B15/04 ,  C23C18/16 ,  C23C18/24 ,  C25D1/00 ,  C25D5/02 ,  C25D5/08 ,  C25D5/10 ,  C25D5/14 ,  C25D5/18 ,  C25D17/00 ,  C25D17/12 ,  C25D21/10

CPC classification number: C25D1/20 ,  B22F3/1055 ,  B22F3/24 ,  B22F7/04 ,  B22F2003/242 ,  B22F2007/042 ,  B22F2998/10 ,  B23K26/342 ,  B23K26/70 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y80/00 ,  C23C18/1641 ,  C23C18/1653 ,  C23C18/1657 ,  C23C18/1666 ,  C23C18/1689 ,  C23C18/24 ,  C23C18/31 ,  C25D1/00 ,  C25D1/003 ,  C25D3/12 ,  C25D5/022 ,  C25D5/08 ,  C25D5/10 ,  C25D5/12 ,  C25D5/14 ,  C25D5/18 ,  C25D5/56 ,  C25D17/007 ,  C25D17/008 ,  C25D17/12 ,  C25D21/10

Abstract: Articles prepared by additive manufacturing of preforms that are coated by electrodeposition of nanolaminate materials, and methods of their production are described.

公开(公告)号：EP3235927A3

公开(公告)日：2018-01-24

申请号：EP17000876.7

申请日：2014-11-14

Applicant: YKK Corporation

Inventor： Hasegawa, Kenji

IPC: C25D5/00 ,  C25D5/22 ,  C25D7/00 ,  C25D7/02 ,  C25D17/12 ,  C25D21/10 ,  C25F3/16 ,  C25D17/22 ,  B24B31/14 ,  B24B1/00 ,  C25D17/00 ,  C25D5/18

CPC classification number: C25D5/022 ,  B24B1/002 ,  B24B1/005 ,  B24B31/112 ,  B24B31/14 ,  C25D5/00 ,  C25D5/026 ,  C25D5/18 ,  C25D5/22 ,  C25D7/00 ,  C25D7/02 ,  C25D17/00 ,  C25D17/12 ,  C25D17/22 ,  C25D21/10 ,  C25F3/02 ,  C25F3/20 ,  C25F3/24 ,  C25F7/00

Abstract: There is provided a method for subjecting garment accessories to a surface electrolytic treatment, which can advantageously provide various metallic colors to metallic garment accessories in a cost effective manner. The method can provide a first metallic color on one side of outer surface of the garment accessory while at the same time providing a second metallic color on the other side of the outer surface, by placing one or more metallic garment accessories in an electrolytic solution in a non-contact state with an anode and a cathode for passing electric current through the electrolytic solution, passing electric current through the electrolytic solution and generating a bipolar phenomenon on the garment accessory. The method may further comprise the step of controlling the posture of the garment accessory such that the one side of the outer surface of the garment accessory faces the anode and the other side faces the cathode during passing electric current through the electrolytic solution. The method may further comprise the step of polishing at least a part of the outer surface of the garment accessory during passing electric current through the electrolytic solution.

Abstract translation: 提供了一种使服装附件经受表面电解处理的方法，该方法可以有利地以成本有效的方式向金属服装附件提供各种金属颜色。 该方法可以在服装附件的外表面的一侧上提供第一金属颜色，同时通过将一个或多个金属服装附件放置在外表面的另一侧上的电解溶液中而在外表面的另一侧上提供第二金属颜色 具有阳极和阴极的非接触状态，用于使电流流过电解溶液，使电流流过电解溶液并在服装附件上产生双极现象。 该方法可以进一步包括控制服装附件的姿势的步骤，使得在电流通过电解溶液的过程中，服装附件的外表面的一侧面向阳极并且另一侧面向阴极。 该方法还可以包括在电流通过电解溶液的过程中抛光服装辅助设备的外表面的至少一部分的步骤。

公开(公告)号：EP3257972A2

公开(公告)日：2017-12-20

申请号：EP17175968.1

申请日：2017-06-14

Applicant: Lockheed Martin Corporation

Inventor： THOMAS, Jr., William Alfred

IPC: C25D5/02 ,  C25D15/00 ,  C25D1/00 ,  C25D1/08 ,  C25D7/04

CPC classification number: C25D1/003 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C25D1/00 ,  C25D1/08 ,  C25D1/20 ,  C25D5/022 ,  C25D7/04 ,  C25D15/00

Abstract: In certain embodiments, a method comprises placing nonconductive fibers (210) adjacent to a conductive material (220), immersing the nonconductive fibers (210) and the conductive material (220) in a plating medium (260), and applying a voltage to the conductive material (220) to initiate electroplating. The method further comprises engulfing, by electroplating, the nonconductive fibers (210) in metal to create a metal matrix composite (270).

公开(公告)号：EP3225719A1

公开(公告)日：2017-10-04

申请号：EP17163063.5

申请日：2017-03-27

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： THORSETH, Matthew ,  HAZEBROUCK, Rebecca ,  SCALISI, Mark ,  NIAZIMBETOVA, Zuhra ,  DZIEWISZEK, Joanna

IPC: C25D7/12 ,  C25D3/38 ,  C25D5/02 ,  C25D7/00

CPC classification number: C25D5/022 ,  C25D3/38 ,  C25D7/00 ,  C25D7/123

Abstract: Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which provide megafeatures having a good %TIR and %WID balance.

Abstract translation: 铜电镀浴和方法能够在具有基本均匀的形态和减少的结节发展的高电流密度下镀覆光刻胶限定的超大特征。 铜电镀浴包括含杂环氮的共聚物的混合物，其提供具有良好的％TIR和％WID平衡的超大特征。