公开(公告)号：EP1570572B1

公开(公告)日：2018-12-26

申请号：EP03790018.0

申请日：2003-11-24

申请人： Cree, Inc.

发明人： PENGELLY, Raymond, Sydney ,  WOOD, Simon, Maurice ,  QUINN, John, Phillip

IPC分类号： H03F3/68

CPC分类号： H03F3/602 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2223/6644 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13064 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Disclosed are a multi-chip power amplifier comprising a plurality chips with each chip being a transistor amplifier, and a housing in which all of the semiconductor chips are mounted. A plurality of input leads extend into the housing and a plurality of output leads extend from the housing. A plurality of first matching networks couple a semiconductor chip to an input lead and a plurality of second matching networks couple each semiconductor chip to an output lead whereby each chip has its own input lead and output lead. By providing all amplifier chips within a single housing with matching networks within the housing coupling the chips to the input and output leads, manufacturing cost is reduced and the overall package footprint on a mounting substrate is reduced. Further, the close proximity of the chips within the housing reduces phase differences among signals in the semiconductor chips.

公开(公告)号：EP1620325B1

公开(公告)日：2014-09-10

申请号：EP04749959.5

申请日：2004-04-09

申请人： Cree, Inc.

发明人： PENGELLY, Raymond, Sydney ,  WOOD, Simon, Maurice

IPC分类号： H03F1/32 ,  H03F3/60 ,  H03F1/02

CPC分类号： H03F1/0288 ,  H03F1/0277 ,  H03F1/32 ,  H03F3/602 ,  H03F2200/451 ,  H03F2201/3203