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公开(公告)号:EP4156261B1
公开(公告)日:2024-10-09
申请号:EP20947073.1
申请日:2020-07-31
CPC classification number: H01L23/66 , H01L2223/667720130101 , H01L2223/661620130101 , H01L23/3677 , H01L24/96 , H01L2224/1210520130101 , H01L2224/251820130101 , H01L2224/0618120130101 , H01L2924/1032920130101 , H01L2924/103320130101 , H01L2924/1025320130101 , H01L25/18 , H01L25/0652 , H01L25/105 , H01L2225/103520130101 , H01L2225/105820130101 , H01L2225/109420130101 , H01L2224/0822520130101 , H01Q1/2283 , H01Q3/26 , H01Q21/065
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公开(公告)号:EP4434033A1
公开(公告)日:2024-09-25
申请号:EP22896265.0
申请日:2022-05-14
Applicant: SanDisk Technologies LLC
Inventor: YANG, Xiang , WU, Fanqi , GUO, Jiacen , YUAN, Jiahui
CPC classification number: G11C16/3459 , G11C11/5628 , G11C16/32 , G11C16/0483 , G11C16/08 , G11C16/24 , G11C16/10 , G11C16/3427 , H01L23/66 , H01L25/0657 , H01L2225/0656520130101 , H01L2225/0654120130101 , H01L2225/0651720130101 , H01L2225/0651320130101 , H01L2225/0650620130101 , H01L2225/065120130101 , H10B43/27
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公开(公告)号:EP4428913A2
公开(公告)日:2024-09-11
申请号:EP24191249.2
申请日:2020-01-15
Applicant: MediaTek Inc.
Inventor: HSU, Chia-Hao , CHEN, Tai-Yu , TSAI, Shiann-Tsong , LIU, Hsing-Chih , HSU, Yao-Pang , CHEN, Chi-Yuan , LEE, Chung-Fa
IPC: H01L23/00
CPC classification number: H01L2224/7320420130101 , H01L2223/667720130101 , H01L23/3677 , H01L23/66 , H01L24/33 , H01L23/49816 , H01L23/4334 , H01L23/3128 , H01L23/49822 , H01L2224/8381520130101 , H01L2224/8319220130101 , H01L2224/9222520130101 , H01L2224/3223520130101 , H01L2224/3318120130101 , H01L2224/4822720130101 , H01L2224/7321520130101 , H01L2224/3201420130101 , H01L2924/1816120130101 , H01L24/16 , H01L24/32 , H01L24/29 , H01L24/73 , H01L2224/1314720130101 , H01L2224/1623820130101 , H01L2224/291920130101 , H01L2224/3214520130101 , H01L2224/7326520130101 , H01L2224/7325320130101
Abstract: A semiconductor package (1) includes a base (10) having an upper surface (10a) and a lower surface (10b) opposite to the upper surface (10a). An antenna array structure (11) is embedded at the upper surface (10a) of the base (10). An IC die (20) is mounted on the lower surface (10b) of the base (10) in a flip-chip manner so that a backside of the IC die (20) is available for heat dissipation. Solder ball pads (118, 120) are disposed on the lower surface (10b) of the base (10) and arranged around the IC die (20). The semiconductor package (1) further includes a metal thermal interface layer (30) having a backside metal layer (310) that is in direct contact with the backside of the IC die (20), and a solder paste (320) conformally printed on the backside metal layer (310).
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公开(公告)号:EP4423809A1
公开(公告)日:2024-09-04
申请号:EP23715647.6
申请日:2023-03-13
Applicant: Amazon Technologies Inc.
Inventor: ABDEL-DAYEM, Bassam , VOLPE, Thomas A.
CPC classification number: H01L23/50 , H01L25/16 , H01L25/0655 , H01L23/562 , H01L23/66 , H01L25/18 , H01L23/5385
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公开(公告)号:EP4418542A1
公开(公告)日:2024-08-21
申请号:EP21961982.2
申请日:2021-10-30
Applicant: Huawei Technologies Co., Ltd.
Inventor: DING, Wenqi , ZHOU, Qian , TANG, Haizheng , CUI, Changyun , LIANG, Le , ZHENG, Wenquan , ZHOU, Xiaomin
Abstract: Embodiments of this application disclose a communication chip, a communication module, a communication system, and a base station. The communication chip specifically includes a frequency mixer, a power division module, and a switch module. The frequency mixer is connected to a first interface, and the frequency mixer is configured to perform frequency conversion on a first input signal received by the first interface or a first output signal that needs to be sent by the first interface. The power division module is connected to a second interface, and the power division module is configured to perform combination on a second input signal received by the second interface or perform power division on a second output signal that needs to be sent by the second interface. The switch module is connected to a third interface. The third interface is configured to receive a third input signal or send a third output signal. The switch module is configured to control the second interface to form a closed circuit with the third interface through the power division module, or to form a closed circuit with the first interface through the power division module and the frequency mixer, so that the communication chip can be used as a driver chip or a frequency mixer chip in series at the same time, thereby reducing a loss of a power divider at low costs.
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公开(公告)号:EP3884516B1
公开(公告)日:2024-07-31
申请号:EP19824213.3
申请日:2019-11-19
CPC classification number: H01L24/01 , H01L24/48 , H01L2224/4514720130101 , H01L2224/4809120130101 , H01L2224/4819520130101 , H05B6/686 , H01L23/66 , H01L2223/661120130101 , H01L2223/665520130101 , H05B6/6476 , H01L2224/0404220130101 , H01L2924/3011120130101 , H01L2924/1910720130101 , H01L2924/1904120130101 , H01L2224/4911120130101 , H01L2924/142120130101 , H01L2224/4501420130101 , H01L2224/4815520130101 , H01L2224/484720130101 , H01L24/49 , H01L2924/1619520130101 , H01L2924/1910520130101 , H01L2924/103320130101 , H01L24/45 , H01L2924/35120130101 , H01L2224/4917520130101 , H01L2224/4847220130101 , H01L2224/4910920130101 , H01L2224/4512420130101 , H01L2224/4515520130101
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公开(公告)号:EP4404257A1
公开(公告)日:2024-07-24
申请号:EP23163790.1
申请日:2023-03-23
Applicant: United Microelectronics Corp.
Inventor: HUNG, Ching-Wen , LAI, Jinn-Horng , WANG, Yan-Zung , CHEN, Peng-Hsiu , HSIEH, Su-Ming
IPC: H01L23/522 , H01L23/482 , H01L23/66 , H01L29/417
CPC classification number: H01L23/5225 , H01L23/4824 , H01L23/66 , H01L29/41758 , H01L2223/664420130101
Abstract: A radio-frequency (RF) device includes a main device on a substrate, a first port extending along a first direction adjacent to a first side of the main device, a second port extending along the first direction adjacent to a second side of the main device, a first shield structure adjacent to a third side of the main device, a second shield structure adjacent to a fourth side of the main device, a first connecting structure extending along a second direction to connect the first port and the main device, and a second connecting structure extending along the second direction to connect the second port and the main device.
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公开(公告)号:EP4402750A1
公开(公告)日:2024-07-24
申请号:EP22761870.9
申请日:2022-08-01
Applicant: QUALCOMM INCORPORATED
Inventor: WE, Hong Bok , BUOT, Joan Rey Villarba , PATIL, Aniket
CPC classification number: H01Q1/2283 , H01Q21/065 , H01Q23/00 , H01Q25/005 , H01L23/66 , H01L2223/667720130101 , H01Q21/28 , H01Q1/526 , H01L23/552 , H01L25/0655 , H01L25/50
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公开(公告)号:EP4391044A1
公开(公告)日:2024-06-26
申请号:EP23214905.4
申请日:2023-12-07
Applicant: Sumitomo Electric Device Innovations, Inc.
Inventor: Wong, James , Kawasaki, Kento
IPC: H01L23/482 , H01L23/66 , H03F1/02 , H01L27/02 , H01L29/20 , H01L29/417 , H01L29/778
CPC classification number: H03F1/0288 , H01L23/4824 , H01L23/66 , H01L2223/664420130101 , H01L2223/665520130101 , H01L27/0207 , H01L29/41758 , H01L29/2003 , H01L29/7786
Abstract: A Doherty amplifier according to the present disclosure includes a substrate, a first transistor provided on the substrate, the first transistor including a plurality of first gate electrodes extending in a first direction, a plurality of first drain electrodes extending in the first direction, a first gate bus bar to which a first signal of two signals obtained by dividing an input signal is input and to which the plurality of first gate electrodes are electrically connected, and a first drain bus bar provided so as to dispose the plurality of first gate electrodes and the plurality of first drain electrodes between the first gate bus bar and the first drain bus bar, the plurality of first drain electrodes being electrically connected to the first drain bus bar, a second transistor provided on the substrate, the transistor including a plurality of second gate electrodes extending in a second direction, a plurality of second drain electrodes extending in the second direction, a second gate bus bar having a first end to which a second signal of the two signals is input, the plurality of second gate electrodes being electrically connected to the second gate bus bar, and a second drain bus bar provided so as to dispose the plurality of second gate electrodes and the plurality of second drain electrodes between the second gate bus bar and the second drain bus bar, the plurality of second drain electrodes being electrically connected to the second drain bus bar, a combining node provided on the substrate and combining the first signal amplified by the first transistor and the second signal amplified by the second transistor, a first line provided on the substrate and connecting the first drain bus bar and the combining node, and a second line provided on the substrate, connecting the second drain bus bar and the combining node, and connected to a second end of the second drain bus bar located diagonally across the second transistor with respect to the first end.
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公开(公告)号:EP4187451B1
公开(公告)日:2024-06-26
申请号:EP21210843.5
申请日:2021-11-26
IPC: G06N10/40 , H01L23/552 , H01L23/053
CPC classification number: H01L23/552 , H01L23/053 , G06N10/40 , H01L23/66
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