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公开(公告)号：EP3657558A2
公开(公告)日：2020-05-27
申请号：EP20150591.4
申请日：2009-03-13
申请人： Cree, Inc.
发明人： YUAN, Thomas , KELLER, Bernd , IBBETSON, James , TARSA, Eric J. , NEGLEY, Gerald
摘要： A white light emitting diode (LED) package (60) comprising an array of LED chips (62) mounted on a planar surface of a submount (64) with the LED chips (62) capable of emitting light in response to an electrical signal. The LED chips (62) comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens (66) is overmolded over the LED array. The diameter of the overmolded lens (66) is greater than 5 millimeters, which is the same as or larger than the width of the LED array.
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公开(公告)号：EP2304817A2
公开(公告)日：2011-04-06
申请号：EP09750906.1
申请日：2009-03-13
申请人： Cree, Inc.
IPC分类号： H01L33/00 , H01L25/075 , H01L27/15
CPC分类号： H01L33/60 , H01L25/0753 , H01L33/58 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/181 , H05B33/0821 , H05B33/0857 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
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公开(公告)号：EP2304817B1
公开(公告)日：2020-01-08
申请号：EP09750906.1
申请日：2009-03-13
申请人： Cree, Inc.
IPC分类号： H01L33/64 , H01L25/075 , H01L33/58 , H05B33/08
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公开(公告)号：EP3657558A3
公开(公告)日：2020-08-26
申请号：EP20150591.4
申请日：2009-03-13
申请人： Cree, Inc.
发明人： YUAN, Thomas , KELLER, Bernd , IBBETSON, James , TARSA, Eric J. , NEGLEY, Gerald
摘要： A white light emitting diode (LED) package (60) comprising an array of LED chips (62) mounted on a planar surface of a submount (64) with the LED chips (62) capable of emitting light in response to an electrical signal. The LED chips (62) comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens (66) is overmolded over the LED array. The diameter of the overmolded lens (66) is greater than 5 millimeters, which is the same as or larger than the width of the LED array.
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公开(公告)号：EP2291860A1
公开(公告)日：2011-03-09
申请号：EP09758647.3
申请日：2009-04-03
发明人： YUAN, Thomas , KELLER, Bernd , TARSA, Eric , IBBETSON, James , MORGAN, Frederick , DOWLING, Kevin , LYS, Ihor
IPC分类号： H01L25/075
CPC分类号： H01L25/0753 , F21K9/00 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2924/09701 , H05B33/0821 , H05B33/0857 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.
摘要翻译： 根据本发明的LED组件包括安装在基座上的LED芯片的阵列，LED芯片能够响应于电信号而发光。 阵列可以包括以两种颜色的光发射的LED芯片，其中LED组件发射包括两种颜色的光的组合的光。 LED芯片阵列中包含一个单一的镜头。 LED芯片阵列可以发射大于800流明的光，驱动电流小于150毫安。 LED芯片组件也可以在低于3000度K的温度下工作。在一个实施例中，LED阵列在基座上呈大致圆形的图案。
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