公开(公告)号：EP2291860A1

公开(公告)日：2011-03-09

申请号：EP09758647.3

申请日：2009-04-03

申请人： Cree, Inc. ,  Koninklijke Philips Electronics N.V.

发明人： YUAN, Thomas ,  KELLER, Bernd ,  TARSA, Eric ,  IBBETSON, James ,  MORGAN, Frederick ,  DOWLING, Kevin ,  LYS, Ihor

IPC分类号： H01L25/075

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.

摘要翻译： 根据本发明的LED组件包括安装在基座上的LED芯片的阵列，LED芯片能够响应于电信号而发光。 阵列可以包括以两种颜色的光发射的LED芯片，其中LED组件发射包括两种颜色的光的组合的光。 LED芯片阵列中包含一个单一的镜头。 LED芯片阵列可以发射大于800流明的光，驱动电流小于150毫安。 LED芯片组件也可以在低于3000度K的温度下工作。在一个实施例中，LED阵列在基座上呈大致圆形的图案。

公开(公告)号：EP3848971A1

公开(公告)日：2021-07-14

申请号：EP21159754.7

申请日：2010-04-06

申请人： Cree, Inc.

发明人： IBBETSON, James ,  HEIKMAN, Sten

IPC分类号： H01L27/15 ,  H01L33/00

摘要： A monolithic LED chip (60) is disclosed comprising a plurality of junctions or sub-LEDs (62a-c) mounted on a submount (64). The sub-LEDs are serially interconnected such that the voltage necessary to drive the sub-LEDs is dependent on the number of serially interconnected sub-LEDs and the junction voltage of the sub-LEDs. Methods for fabricating a monolithic LED chip are also disclosed with one method comprising providing a single junction LED on a submount and separating the single junction LED into a plurality of sub-LEDs. The sub-LEDs are then serially interconnected such that the voltage necessary to drive the sub-LEDs is dependent on the number of the serially interconnected sub-LEDs and the junction voltage of the sub-LEDs.

公开(公告)号：EP3657558A2

公开(公告)日：2020-05-27

申请号：EP20150591.4

申请日：2009-03-13

申请人： Cree, Inc.

发明人： YUAN, Thomas ,  KELLER, Bernd ,  IBBETSON, James ,  TARSA, Eric J. ,  NEGLEY, Gerald

IPC分类号： H01L33/58 ,  H01L25/075 ,  F21K9/66 ,  H01L33/60 ,  H05B45/20 ,  H05B45/40

摘要： A white light emitting diode (LED) package (60) comprising an array of LED chips (62) mounted on a planar surface of a submount (64) with the LED chips (62) capable of emitting light in response to an electrical signal. The LED chips (62) comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens (66) is overmolded over the LED array. The diameter of the overmolded lens (66) is greater than 5 millimeters, which is the same as or larger than the width of the LED array.

公开(公告)号：EP1692729B1

公开(公告)日：2020-02-12

申请号：EP04812190.9

申请日：2004-11-24

申请人： Cree, Inc.

发明人： KELLER, Bernd ,  IBBETSON, James ,  ANDREWS, Peter, S. ,  NEGLEY, Gerald, H. ,  HILLER, Norbert

IPC分类号： H01L33/00 ,  H01L25/16

公开(公告)号：EP2823516A1

公开(公告)日：2015-01-14

申请号：EP13709035.3

申请日：2013-03-01

申请人： Cree, Inc.

发明人： IBBETSON, James ,  LI, Ting ,  KELLER, Bernd

IPC分类号： H01L33/46 ,  G02B19/00 ,  H01L33/48 ,  H01L33/56

CPC分类号： H01L33/46 ,  G02B19/0028 ,  G02B19/0061 ,  H01L33/48 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A high efficiency light emitting diode with a composite high reflectivity layer integral to said LED or package to improve emission efficiency. One embodiment of a LED package comprises a LED (52,302) mounted on a substrate (300) with an encapsulant (304) over said LED and a composite high reflectivity layer (62, 100, 362) arranged to reflect emitted light. The composite layer comprises a plurality of layers (102, 106, 108, 110, 308) such that at least one of said plurality of layers has an index of refraction lower than the encapsulant (304) and a reflective layer (126, 164, 310) on a side of said plurality of layers opposite the LED. In some embodiments, conductive vias (128, 166, 318) are included through the composite layer to allow an electrical signal to pass through the layer to the LED.

公开(公告)号：EP1597777B1

公开(公告)日：2013-04-24

申请号：EP04714213.8

申请日：2004-02-24

申请人： CREE, INC.

发明人： IBBETSON, James ,  TARSA, Eric

IPC分类号： H01L33/58 ,  H01L33/50

CPC分类号： H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

公开(公告)号：EP1774598B1

公开(公告)日：2011-09-14

申请号：EP05769290.7

申请日：2005-06-30

申请人： CREE, INC.

发明人： IBBETSON, James ,  KELLER, Bernd ,  PARIKH, Primit

IPC分类号： H01L33/48 ,  H01L33/62

CPC分类号： H01L33/486 ,  H01L23/481 ,  H01L24/48 ,  H01L33/62 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged light emitting device includes a carrier substrate (20) having a top surface and a bottom surface, first and second conductive vias (22S, B) extending from the top surface of the substrate (20) to the bottom surface of the substrate, and a bond pad (24) on the top surface of the substrate in electrical contact with the first conductive via (22A). A diode (16) having first and second electrodes is mounted on the bond pad with the first electrode (26) is in electrical contact with the bond pad (24). A passivation layer (32) is formed on the diode (16), exposing the second electrode of the diode (16). A conductive trace (33) is formed on the top surface of the carrier substrate in electrical contact with the second conductive via (22B) and the second electrode. The conductive trace is on and extends across the passivation layer to contact the second electrode. Methods of packaging light emitting devices include providing an epiwafer including a growth substrate and an epitaxial structure on the growth substrate, bonding a carrier substrate to the epitaxial structure of the epiwafer, forming a plurality of conductive vias through the carrier substrate, defining a plurality of isolated diodes in the epitaxial structure, and electrically connecting at least one conductive via to respective ones of the plurality of isolated diodes.

公开(公告)号：EP1787335A1

公开(公告)日：2007-05-23

申请号：EP05761972.8

申请日：2005-06-09

申请人： CREE, INC.

发明人： BATRES, Max ,  IBBETSON, James ,  LI, Ting ,  SAXLER, Adam, W.

IPC分类号： H01L33/00

摘要： The surface morphology of an LED light emitting surface is changed by applying a reactive ion etch (RIE) process to the light emitting surface. Etched features, such as truncated pyramids, may be formed on the emitting surface, prior to the RIE process, by cutting into the surface using a saw blade or a masked etching technique. Sidewall cuts may also be made in the emitting surface prior to the RIE process. A light absorbing damaged layer of material associated with saw cutting is removed by the RIE process. The surface morphology created by the RIE process may be emulated using different, various combinations of non-RIE processes such as grit sanding and deposition of a roughened layer of material or particles followed by dry etching.

公开(公告)号：EP1730784A2

公开(公告)日：2006-12-13

申请号：EP05729958.8

申请日：2005-03-24

申请人： CREE, INC. ,  Andrews, Peter S.

发明人： COLEMAN, Thomas, G. ,  IBBETSON, James ,  LEUNG, Michael ,  NEGLEY, Gerald, H. ,  TARSA, Eric

IPC分类号： H01L29/22

CPC分类号： H01L33/58 ,  H01L33/52 ,  H01L33/60 ,  H01L2924/181 ,  H01L2924/00012

摘要： Methods of packaging a semiconductor light emitting device positioned in a reflective cavity are provided. A first quantity of encapsulant material is dispensed into the reflective cavity including the light emitting device therein and the first quantity of encapsulant in the reflective cavity is cured. A second quantity of encapsulant material is dispensed onto the cured first quantity of encapsulant material. A lens is positioned in the reflective cavity on the dispensed second quantity of encapsulant material. The dispensed second quantity of encapsulant material is cured to attach the lens in the reflective cavity.

公开(公告)号：EP3657558A3

公开(公告)日：2020-08-26

申请号：EP20150591.4

申请日：2009-03-13

申请人： Cree, Inc.

发明人： YUAN, Thomas ,  KELLER, Bernd ,  IBBETSON, James ,  TARSA, Eric J. ,  NEGLEY, Gerald

IPC分类号： H01L33/58 ,  H01L25/075 ,  F21K9/66 ,  H01L33/60 ,  H05B45/20 ,  H05B45/40

摘要： A white light emitting diode (LED) package (60) comprising an array of LED chips (62) mounted on a planar surface of a submount (64) with the LED chips (62) capable of emitting light in response to an electrical signal. The LED chips (62) comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens (66) is overmolded over the LED array. The diameter of the overmolded lens (66) is greater than 5 millimeters, which is the same as or larger than the width of the LED array.