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公开(公告)号：EP0717762A1
公开(公告)日：1996-06-26
申请号：EP94927305.0
申请日：1994-09-02
申请人： RODEL, INC.
CPC分类号： C09K3/1454
摘要： Disclosed is a process for preparing activated compositions and the compositions derived therefrom which are suitable for polishing surfaces, particularly integrated circuits, wherein a base abrasive is activated by addition of a second cation whose oxide exhibits a higher polishing rate than the base abrasive alone. The activation is effected by chemical adsorption of the activating cation onto the base abrasive during cyclic impact in an aqueous medium whose pH is at a level which is favorable for adsorption of the activating cation onto the base abrasive surface.
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公开(公告)号：EP0840664A1
公开(公告)日：1998-05-13
申请号：EP96916757.0
申请日：1996-05-30
申请人： Rodel, Inc.
摘要： An improved slurry composition and methods of using it are provided for final polishing of silicon wafers. The composition comprises water, submicron silica particles between 0.2 and 0.5 percent by weight of this composition, a salt at a concentration of about 100 to about 1000 ppm, an amine compound at a concentration sufficient to effect a composition pH of about 8 to about 11, and a polyelectrolyte dispersion agent at a concentration of about 20 to about 500 ppm, wherein the composition has a total sodium and potassium content below about 1 ppm, and an iron, nickel, and copper content each below about 0.1 ppm, all ppm being parts per million by weight of the composition.
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公开(公告)号：EP0717762B1
公开(公告)日：2001-06-20
申请号：EP94927305.6
申请日：1994-09-02
申请人： RODEL, INC.
IPC分类号： C09G1/02
CPC分类号： C09K3/1454
摘要： Disclosed is a process for preparing activated compositions and the compositions derived therefrom which are suitable for polishing surfaces, particularly integrated circuits, wherein a base abrasive is activated by addition of a second cation whose oxide exhibits a higher polishing rate than the base abrasive alone. The activation is effected by chemical adsorption of the activating cation onto the base abrasive during cyclic impact in an aqueous medium whose pH is at a level which is favorable for adsorption of the activating cation onto the base abrasive surface.
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公开(公告)号：EP0840664B1
公开(公告)日：2001-03-07
申请号：EP96916757.6
申请日：1996-05-30
申请人： Rodel, Inc.
IPC分类号： B24B1/00 , B24C1/00 , C09G1/02 , H01L21/306 , C09K3/14
摘要： An improved slurry composition and methods of using it are provided for final polishing of silicon wafers. The composition comprises water, submicron silica particles between 0.2 and 0.5 percent by weight of this composition, a salt at a concentration of about 100 to about 1000 ppm, an amine compound at a concentration sufficient to effect a composition pH of about 8 to about 11, and a polyelectrolyte dispersion agent at a concentration of about 20 to about 500 ppm, wherein the composition has a total sodium and potassium content below about 1 ppm, and an iron, nickel, and copper content each below about 0.1 ppm, all ppm being parts per million by weight of the composition.
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