公开(公告)号：EP0984846B1

公开(公告)日：2004-11-24

申请号：EP98903401.2

申请日：1998-01-12

申请人： RODEL, INC.

发明人： COOK, Lee, Melbourne ,  JAMES, David, B. ,  CHECHIK, Nina, G. ,  BUDINGER, William, D.

IPC分类号： B24D3/00

CPC分类号： B24B37/22 ,  B24B37/26 ,  B24D3/00 ,  B24D11/00 ,  B24D18/00

摘要： An innovative method of manufacturing polishing pads using photo-curing polymers (14) and photolithography. The photolithography enables the creation of useful surface patterns not possible with conventional machining techniques and enables the use of pad materials otherwise too soft to pattern by conventional machining techniques.

公开(公告)号：EP0868543A1

公开(公告)日：1998-10-07

申请号：EP96936459.0

申请日：1996-10-04

申请人： RODEL, INC.

发明人： WANG, Jiun-Fang ,  SETHURAMAN, Anantha ,  WANG, Huey-Ming ,  COOK, Lee, Melbourne

IPC分类号： B24B37 ,  C09G1 ,  C09K3 ,  C23F1 ,  C23F3 ,  H01L21

CPC分类号： C09K3/1463 ,  C09G1/02 ,  C09K3/1409 ,  C23F3/00

摘要： An aqueous slurry is provided for polishing or planarizing a workpiece which contains a metal, the solids portion of said slurry being comprised of about 1 to about 50 percent by weight of submicron alpha-alumina, the remainder of the solids being of a substantially less abrasive composition chosen from one or more of the group consisting of aluminum hydrates, aluminum hydroxides, gamma-alumina, delta-alumina, amorphous alumina, and amorphous silica. Also provided is a method for polishing the surface of a work piece which contains a metal wherein said aqueous slurry is used as the polishing composition during chemical-mechanical polishing.

公开(公告)号：EP0717762B1

公开(公告)日：2001-06-20

申请号：EP94927305.6

申请日：1994-09-02

申请人： RODEL, INC.

发明人： COOK, Lee, Melbourne ,  LONCKI, Scott, B. ,  BRANCALEONI, Gregory

IPC分类号： C09G1/02

CPC分类号： C09K3/1454

摘要： Disclosed is a process for preparing activated compositions and the compositions derived therefrom which are suitable for polishing surfaces, particularly integrated circuits, wherein a base abrasive is activated by addition of a second cation whose oxide exhibits a higher polishing rate than the base abrasive alone. The activation is effected by chemical adsorption of the activating cation onto the base abrasive during cyclic impact in an aqueous medium whose pH is at a level which is favorable for adsorption of the activating cation onto the base abrasive surface.

公开(公告)号：EP0840664B1

公开(公告)日：2001-03-07

申请号：EP96916757.6

申请日：1996-05-30

申请人： Rodel, Inc.

发明人： LONCKI, Scott, B. ,  COOK, Lee, Melbourne ,  SHEN, James ,  PIERCE, Keith, G.

IPC分类号： B24B1/00 ,  B24C1/00 ,  C09G1/02 ,  H01L21/306 ,  C09K3/14

摘要： An improved slurry composition and methods of using it are provided for final polishing of silicon wafers. The composition comprises water, submicron silica particles between 0.2 and 0.5 percent by weight of this composition, a salt at a concentration of about 100 to about 1000 ppm, an amine compound at a concentration sufficient to effect a composition pH of about 8 to about 11, and a polyelectrolyte dispersion agent at a concentration of about 20 to about 500 ppm, wherein the composition has a total sodium and potassium content below about 1 ppm, and an iron, nickel, and copper content each below about 0.1 ppm, all ppm being parts per million by weight of the composition.

公开(公告)号：EP0851798A1

公开(公告)日：1998-07-08

申请号：EP97945165.0

申请日：1997-02-26

申请人： RODEL, INC.

发明人： COSSABOON, David ,  WANG, Jiun-Fang ,  COOK, Lee, Melbourne

IPC分类号： C09G1

CPC分类号： C09G1/02

摘要： A composition is provided, which is suitable for polishing SiO2, silicates, and silicon nitride, comprising an aqueous slurry of submicron SiO2 particles and a soluble inorganic salt or combination of soluble inorganic salts of total solution concentration below the critical coagulation concentration for the slurry, wherein the slurry pH is adjusted to within the range of about 9 to 10 by addition of a soluble amine or mixture of soluble amines. Optionally, the compositions of this invention may also comprise a polyhydric alcohol.

公开(公告)号：EP0985059B1

公开(公告)日：2002-11-06

申请号：EP98911675.1

申请日：1998-03-16

申请人： Rodel, Inc.

发明人： WANG, Jiun-Fang ,  SETHURAMAN, Anantha, R. ,  COOK, Lee, Melbourne

IPC分类号： C23F1/14 ,  C09K3/14 ,  C09G1/02 ,  H01L21/306

CPC分类号： H01L21/3212 ,  C09G1/02 ,  C09K3/1463 ,  C23F3/00

摘要： An aqueous slurry is provided which is useful for the chemical-mechanical polishing of substrates containing titanium comprising: water, submicron abrasive particles, an oxidizing agent, and a combination of complexing agents comprising a phthalate compound and a compound which is a di- or tri-carboxylic acid with at least one hydroxyl group in an alpha position relative to one of the carboxyl groups.

公开(公告)号：EP0717762A1

公开(公告)日：1996-06-26

申请号：EP94927305.0

申请日：1994-09-02

申请人： RODEL, INC.

发明人： COOK, Lee, Melbourne ,  LONCKI, Scott, B. ,  BRANCALEONI, Gregory

IPC分类号： C01B33 ,  C09K3 ,  H01L21

CPC分类号： C09K3/1454

摘要： Disclosed is a process for preparing activated compositions and the compositions derived therefrom which are suitable for polishing surfaces, particularly integrated circuits, wherein a base abrasive is activated by addition of a second cation whose oxide exhibits a higher polishing rate than the base abrasive alone. The activation is effected by chemical adsorption of the activating cation onto the base abrasive during cyclic impact in an aqueous medium whose pH is at a level which is favorable for adsorption of the activating cation onto the base abrasive surface.

公开(公告)号：EP0701499A1

公开(公告)日：1996-03-20

申请号：EP95915502.0

申请日：1995-03-30

申请人： RODEL, INC.

发明人： COOK, Lee, Melbourne ,  ROBERTS, John, V., H. ,  JENKINS, Charles, William ,  PILLAI, Raj, Raghav

IPC分类号： B24B37 ,  A47L13 ,  B24D3 ,  B24D11 ,  B24D13 ,  H01L21

CPC分类号： B24B37/26 ,  A47L13/28 ,  B24D3/28 ,  B24D11/005 ,  B24D11/02 ,  B24D13/00 ,  B24D2203/00

摘要： An improved polishing pad is provided comprising a solid uniform polymer sheet having no intrinsic ability to absorb or transport slurry particles having during use a surface texture or pattern which has both large and small flow channels present simultaneously which permit the transport of slurry across the surface of the polishing pad, where said channels are not part of the material structure but are mechanically produced upon the pad surface. In a preferred version of the invention, the pad texture consists of a macrotexture produced prior to use and a microtexture which is produced by abrasion by a multiplicity of small abrasive points at a regular selected interval during the use of the pad.

公开(公告)号：EP0985059A1

公开(公告)日：2000-03-15

申请号：EP98911675.1

申请日：1998-03-16

申请人： Rodel, Inc.

发明人： WANG, Jiun-Fang ,  SETHURAMAN, Anantha, R. ,  COOK, Lee, Melbourne

IPC分类号： C23F1/14

CPC分类号： H01L21/3212 ,  C09G1/02 ,  C09K3/1463 ,  C23F3/00

摘要： An aqueous slurry is provided which is useful for the chemical-mechanical polishing of substrates containing titanium comprising: water, submicron abrasive particles, an oxidizing agent, and a combination of complexing agents comprising a phthalate compound and a compound which is a di- or tri-carboxylic acid with at least one hydroxyl group in an alpha position relative to one of the carboxyl groups.

公开(公告)号：EP0984846A1

公开(公告)日：2000-03-15

申请号：EP98903401.2

申请日：1998-01-12

申请人： RODEL, INC.

发明人： COOK, Lee, Melbourne ,  JAMES, David, B. ,  CHECHIK, Nina, G. ,  BUDINGER, William, D.

IPC分类号： B24D3/00

CPC分类号： B24B37/22 ,  B24B37/26 ,  B24D3/00 ,  B24D11/00 ,  B24D18/00

摘要： An innovative method of manufacturing polishing pads using photo-curing polymers (14) and photolithography. The photolithography enables the creation of useful surface patterns not possible with conventional machining techniques and enables the use of pad materials otherwise too soft to pattern by conventional machining techniques.