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    POLISHING COMPOSITION
    5.
    发明公开
    POLISHING COMPOSITION 审中-实审

    公开(公告)号：EP4410922A1

    公开(公告)日：2024-08-07

    申请号：EP22876251.4

    申请日：2022-09-27

    申请人： Fujimi Incorporated

    发明人： MORI, Yoshio ,  NAKAGAI, Yuichiro ,  ODA, Hiroyuki

    IPC分类号： C09K3/14 ,  B24B37/00 ,  C09G1/02 ,  C09G1/04 ,  H01L21/304

    CPC分类号： B24B37/00 ,  C09K3/14 ,  H01L21/304 ,  C09G1/02 ,  C09G1/04

    摘要： A polishing composition that can achieve an excellent polishing removal rate for an object to be polished is provided. The polishing composition used for polishing the object to be polished is provided. The polishing composition contains water, and sodium permanganate as an oxidant. In some preferred embodiments, the polishing composition further contains a metal salt selected from salts each of which has a cation containing a metal belonging to Groups 3 to 16 in the periodic table, and an anion. The polishing composition can also be preferably used to polish an object to be polished formed of a high hardness material having a Vickers hardness of 1500 Hv or more.

    WAFER POLISHING SYSTEM
    7.
    发明公开
    WAFER POLISHING SYSTEM 审中-实审

    公开(公告)号：EP4400258A1

    公开(公告)日：2024-07-17

    申请号：EP22866477.7

    申请日：2022-08-30

    申请人： Hangzhou Sizone Electronic Technology Inc.

    发明人： XU, Xiaoyu

    IPC分类号： B24B29/02 ,  B24B37/00 ,  B24B27/00

    摘要： Disclosed in the present invention is a wafer polishing system, at least comprising a polishing unit, which comprises a fixed working station and two polishing modules, wherein the polishing modules are located on two sides of the fixed working station; each polishing module comprises a polishing platform and a polishing arm, which can drive a wafer to move relative to the polishing platform, so as to implement a polishing process; the polishing arms of the polishing modules on the two sides are located in a diagonal direction of the fixed working station; and the polishing arms can respectively swing between the fixed working station and the polishing platforms to transfer the wafer, and movement regions of the polishing arms having an overlapping portion. By means of the present invention, the polishing arm of each polishing module is independently controlled, so as to achieve better stability and flexibility; and only one fixed working station is needed to achieve the cooperation of multiple polishing modules to implement the polishing process of single or multiple wafers, so that the movement path in the polishing process is greatly shortened, which minimizes the time of the transfer process and improves the polishing efficiency.