公开(公告)号：EP1973740A1

公开(公告)日：2008-10-01

申请号：EP07703586.3

申请日：2007-01-02

申请人： Robert Bosch GmbH

发明人： MAIHOEFER, Bernd ,  MEIER, Andreas ,  LEVERKOEHNE, Mark ,  SPEH, Ulrich ,  LIEB, Gunther ,  LEONHARD, Alexandra ,  SCHAEFER, Joerg

IPC分类号： B41F15/34 ,  B41F15/36 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/34 ,  H05K3/40

CPC分类号： B41F15/34 ,  B41C1/14 ,  B41F15/36 ,  B41P2215/12 ,  H05K1/0306 ,  H05K3/005 ,  H05K3/1225 ,  H05K3/4053 ,  H05K3/4061

摘要： The invention relates to a method for producing printing masks (10), in particular for squeegee printing methods and especially those used during the filling of at least one via (12) that is configured in a printed circuit board (11), in which method a template pattern that corresponds to an arrangement of vias (12) on the circuit board is reproduced on the mask (10). According to the invention, the template pattern that is reproduced on the mask (10) is produced during the same working process as the via or vias (12) on the printed circuit board (11), in particular in a punch operation that uses a cluster punch. The invention also relates to a mask.

公开(公告)号：EP2649870A2

公开(公告)日：2013-10-16

申请号：EP11779391.9

申请日：2011-11-03

申请人： Robert Bosch GmbH

发明人： STREICHER, Uwe ,  HARTHERZ, Patrik ,  SCHAEFER, Joerg

IPC分类号： H05K7/14 ,  H05K5/00

CPC分类号： H05K7/1417 ,  H05K5/006

摘要： The invention relates to an electrical circuit arrangement (1), more particularly for a control unit of a motor vehicle, comprising at least one printed circuit board (2) and a housing (3), wherein the housing (3) has at least one guide region (4) for guiding the at least one printed circuit board (2). In this case, provision is made for the at least one printed circuit board (2) to have at least one depression, and for the housing (3) to be mechanically deformed in at least one deformation region (10) of the at least one guide region (4) in such a way that the at least one deformation region (10) is shaped into the at least one depression at least regionally.

公开(公告)号：EP1973740B1

公开(公告)日：2010-04-07

申请号：EP07703586.3

申请日：2007-01-02

申请人： Robert Bosch GmbH

发明人： MAIHOEFER, Bernd ,  MEIER, Andreas ,  LEVERKOEHNE, Mark ,  SPEH, Ulrich ,  LIEB, Gunther ,  LEONHARD, Alexandra ,  SCHAEFER, Joerg

IPC分类号： B41F15/34 ,  B41F15/36 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/34 ,  H05K3/40

CPC分类号： B41F15/34 ,  B41C1/14 ,  B41F15/36 ,  B41P2215/12 ,  H05K1/0306 ,  H05K3/005 ,  H05K3/1225 ,  H05K3/4053 ,  H05K3/4061

公开(公告)号：EP2649870B1

公开(公告)日：2015-01-07

申请号：EP11779391.9

申请日：2011-11-03

申请人： Robert Bosch GmbH

发明人： STREICHER, Uwe ,  HARTHERZ, Patrik ,  SCHAEFER, Joerg

IPC分类号： H05K7/14 ,  H05K5/00

CPC分类号： H05K7/1417 ,  H05K5/006

公开(公告)号：EP2727141A1

公开(公告)日：2014-05-07

申请号：EP12729389.2

申请日：2012-05-30

申请人： Robert Bosch GmbH

发明人： SCHAEFER, Joerg ,  HOLZ, Dieter

IPC分类号： H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H05K7/20

CPC分类号： H01L23/42 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/373 ,  H01L23/3736 ,  H01L2924/0002 ,  H05K7/20854 ,  H01L2924/00

摘要： The invention relates to an electronic circuit arrangement (1, 2) for drawing heat from components (6) which emit heat loss. Components (6) which emit heat loss are arranged on an upper face (8) of a circuit mount (4) of the electronic circuit arrangement (1, 2). The circuit arrangement (1, 2) has a heat sink (10) which has a boundary surface (12) which transmits heat. An intermediate layer (14) which transmits heat is arranged between the boundary surface (12) and a lower face (16) of the circuit mount (4). At least the boundary surface (12) of the heat sink (10) has microstructures (18) which can be embossed and are designed to be embossed at least partially into the intermediate layer (14), which transmits heat, for drawing heat from the electronic components (6) under the action of pressure on the circuit mount (4).