公开(公告)号：EP2783395A1

公开(公告)日：2014-10-01

申请号：EP12851847.9

申请日：2012-11-07

申请人： S3C, Inc.

发明人： NZEADIBE, Ihioma, U. ,  HUSSAIN, Javed ,  CASTAGNA, Joseph ,  YUAN, Li ,  HORTON, Roger

IPC分类号： H01L29/84

CPC分类号： G01L23/26 ,  F02D35/023 ,  F02D2400/22 ,  G01L19/0084

摘要： The present invention disclosed provides for a rugged, compact sensing device for various implementations including those of automotive, marine, and other combustion technologies that require low cost accurate pressure sensing during internal combustion engine process. In one or more aspects of the present invention, a MEMS sensor connection with a flexible circuit is presented and the communication of which is preferably achieved through the use of wire bond technology.

公开(公告)号：EP2567401A1

公开(公告)日：2013-03-13

申请号：EP11778212.8

申请日：2011-05-03

申请人： S3C, Inc.

发明人： HORTON, Roger ,  HUSSAIN, Javed

IPC分类号： H01L23/58

CPC分类号： B81B7/0058 ,  B81C1/00888 ,  B81C2201/053 ,  G01L9/0055 ,  H01L21/78

摘要： A method for separating a plurality of dies on a Micro-Electro-Mechanical System (MEMS) wafer comprising scribing a notch on a first side of the wafer between at least two of the plurality of dies on a first surface and depositing a metal on the first surface of the plurality of dies. The method further comprises scribing a second side of the wafer between at least two of the plurality of dies from a second surface thereof through the notch. The first side and second side are substantially parallel and opposite each other and the first surface and the second surface are substantially parallel and opposite each other. In a process in accordance with the present invention, a method to minimize chipping of the bonding portion of a MEMs device during sawing of the wafer is provided, which minimally affects the process steps associated with separating the die on a wafer.

公开(公告)号：EP2316008A1

公开(公告)日：2011-05-04

申请号：EP09808902.2

申请日：2009-08-21

申请人： S3C, Inc.

发明人： DANGTRAN, John ,  HORTON, Roger

IPC分类号： G01L9/06

CPC分类号： B81B7/0077 ,  B81B7/0019

摘要： A sensor device and a method of forming comprises a die pad receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The die pad includes a base and a support structure with a CTE compliant with the first and second CTE. The die pad has a support structure that protrudes from a base. The support structure has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the base undergoes thermal expansion or contraction forces from a header.